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ISO7763QDBQQ1 - Texas Instruments

Description: Automotive, High Speed, Robust EMC Six-Channel Digital Isolators

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ISO7763QDBQQ1 - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DBQ0016A
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ISO7763QDBQQ1 - Texas Instruments  - 3D model - Small Outline Packages - DBQ0016A
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ISO7763QDBQQ1 Details

  • Manufacturer Part Number:

    ISO7763QDBQQ1

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Date Of Intro:

    2018-12-01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Additional Feature:

    ALSO REQUIRED VCC2 2.25-5.5V SUPPLY; ALSO OPERATE WITH 3.3V AND 5V SUPPLY

  • Interface IC Type:

    DIGITAL ISOLATOR

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e4

  • Length:

    4.905 mm

  • Moisture Sensitivity Level:

    2

  • Number of Channels:

    6

  • Number of Functions:

    6

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SSOP

  • Package Equivalence Code:

    SSOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    2.25 V

  • Supply Voltage-Nom:

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.635 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.895 mm

ISO7763QDBQQ1 Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the signal traces short and away from the power plane to minimize noise and EMI.
  • Use a thermally conductive material for the PCB substrate, and ensure good thermal coupling between the device and the heat sink. Also, consider using a thermal interface material to minimize thermal resistance.
  • Use a shielded enclosure, keep the device away from antennas and other EMI sources, and ensure good grounding and shielding of cables. Also, consider using EMI filters or common-mode chokes to reduce emissions.
  • Use the lowest possible supply voltage, minimize the clock frequency, and use the power-down mode when not transmitting. Also, consider using a low-dropout regulator to reduce power consumption.
  • Ensure the clock frequency is within the specified range (typically 10-100 kHz), and the data transmission rate is within the recommended range (typically 1-10 Mbps). Also, ensure the signal rise and fall times are within the specified limits.

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ISO7763QDBQQ1 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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