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ISO7763QDWQ1 - Texas Instruments

Description: Automotive, High Speed, Robust EMC Six-Channel Digital Isolators

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ISO7763QDWQ1 - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DW0016B
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ISO7763QDWQ1 - Texas Instruments  - 3D model - Small Outline Packages - DW0016B
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ISO7763QDWQ1 Details

  • Manufacturer Part Number:

    ISO7763QDWQ1

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Date Of Intro:

    2018-12-01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Additional Feature:

    ALSO REQUIRED VCC2 2.25-5.5V SUPPLY; ALSO OPERATE WITH 3.3V AND 5V SUPPLY

  • Interface IC Type:

    DIGITAL ISOLATOR

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e4

  • Length:

    10.3 mm

  • Moisture Sensitivity Level:

    2

  • Number of Channels:

    6

  • Number of Functions:

    6

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    2.65 mm

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    2.25 V

  • Supply Voltage-Nom:

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    7.5 mm

ISO7763QDWQ1 Frequently Asked Questions (FAQs)

  • A good PCB layout for the ISO7763QDWQ1 involves keeping the analog and digital grounds separate, using a solid ground plane, and minimizing the length of the signal traces. TI provides a recommended PCB layout in the datasheet and application notes.
  • To ensure reliable operation in high-temperature environments, ensure that the device is operated within its specified temperature range, use a heat sink if necessary, and follow proper thermal design guidelines. Additionally, consider using a thermally-enhanced package option.
  • To mitigate EMI and RFI, use a shielded enclosure, keep the device away from high-frequency sources, use a common-mode choke, and follow proper PCB layout and grounding techniques. TI provides EMI and RFI mitigation guidelines in the datasheet and application notes.
  • To troubleshoot issues with the ISO7763QDWQ1, start by reviewing the datasheet and application notes, checking the device's configuration and setup, and using TI's troubleshooting guides and tools. If necessary, contact TI's technical support for further assistance.
  • When using the ISO7763QDWQ1 in a safety-critical application, ensure that the device is used within its specified operating conditions, follow proper design and verification guidelines, and consider using redundant or fail-safe design techniques. Additionally, consult with TI's safety experts and follow relevant industry standards and regulations.

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ISO7763QDWQ1 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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CMOS, PDSO16