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ISOTMP35BDFQR - Texas Instruments

Description: Robust integrated isolation barrier: Withstand isolation voltage: 3000VRMS Isolation working voltage: 500VRMS Isolation barrier life: > 50 years Temperature sensor accuracy ±0.5°C typical at 25°C ±1.2°C maximum from 0°C to 70°C ±2.5°C maximum from –40°C to 150°C Operating supply range: 2.3V to 5.5V Positive slope sensor gain: 10mV/°C, with 500mV offset at 0°C Fast thermal response: < 2 seconds Short circuit protected output Low power consumption: 9µA (typical) DFQ (SOIC-7) package Safety-relat

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ISOTMP35BDFQR - Texas Instruments - PCB symbol
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ISOTMP35BDFQR - Texas Instruments PCB footprint - Other - Other - SOIC (DFQ) | 7
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ISOTMP35BDFQR - Texas Instruments - 3D model - Other - SOIC (DFQ) | 7
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ISOTMP35BDFQR Details

  • Manufacturer Part Number:

    ISOTMP35BDFQR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Accuracy-Max (Cel):

    1.2 Cel

  • Additional Feature:

    SHORT CIRCUIT PROTECTION

  • Housing:

    PLASTIC

  • JESD-609 Code:

    e4

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    7

  • Operating Current-Max:

    0.012 mA

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Shape/Style:

    RECTANGULAR

  • Sensors/Transducers Type:

    TEMPERATURE SENSOR,ANALOG,VOLTAGE OUTPUT

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    2.3 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Termination Type:

    SOLDER

ISOTMP35BDFQR Frequently Asked Questions (FAQs)

  • Texas Instruments recommends a PCB layout with a solid ground plane, minimal thermal vias, and a thermal pad connected to the ground plane to ensure optimal thermal performance.
  • The thermal pad should be connected to the ground plane using a solder paste or a thermal interface material (TIM) to ensure good thermal conductivity. Avoid using a solder mask or other insulating materials on the thermal pad.
  • The maximum junction temperature (Tj) for the ISOTMP35BDFQR is 150°C. Operating the device above this temperature can reduce its lifespan and affect its performance.
  • Calibration involves trimming the sensor's offset and gain using the TRIM pins. Texas Instruments provides a calibration procedure in the datasheet, which involves measuring the sensor's output at multiple temperatures and adjusting the TRIM pins accordingly.
  • The recommended power-up sequence is to apply VCC first, followed by VDD. This ensures that the internal voltage regulators are powered up correctly and prevents any potential latch-up conditions.

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ISOTMP35BDFQR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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