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ISOW7741BDFMR - Texas Instruments

Description: Digital Isolators Low-emissions, low-ripple, quad-channel, 3/1, reinforced digital isolator with integrated power 20-SOIC -40 to 125

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ISOW7741BDFMR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DFM0020A
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ISOW7741BDFMR - Texas Instruments  - 3D model - Small Outline Packages - DFM0020A
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ISOW7741BDFMR Details

  • Manufacturer Part Number:

    ISOW7741BDFMR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Interface IC Type:

    INTERFACE CIRCUIT

  • JESD-30 Code:

    R-PDSO-G20

  • JESD-609 Code:

    e4

  • Length:

    12.83 mm

  • Moisture Sensitivity Level:

    3

  • Number of Channels:

    4

  • Number of Functions:

    4

  • Number of Terminals:

    20

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HSOP

  • Package Equivalence Code:

    SOP20,.4

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    3.55 mm

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    7.5 mm

ISOW7741BDFMR Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the application note SLUA685, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize electromagnetic interference (EMI).
  • To ensure reliable operation in high-temperature environments, it is essential to follow the recommended thermal management guidelines in the datasheet, including providing adequate heat sinking and airflow. Additionally, the device should be operated within its specified temperature range, and the junction temperature should be monitored to prevent overheating.
  • The ISOW7741BDFMR is designed to operate with high common-mode voltages, but it is essential to ensure that the device is properly biased and that the common-mode voltage does not exceed the maximum rating. Additionally, the system designer should consider the impact of common-mode voltage on the device's performance, including its effect on the signal-to-noise ratio and the potential for electromagnetic interference (EMI).
  • To troubleshoot issues with the ISOW7741BDFMR, it is essential to follow a systematic approach, including reviewing the device's datasheet, application notes, and design files. The system designer should also verify that the device is properly powered, biased, and configured, and that the input and output signals are within the specified ranges. Additionally, the use of diagnostic tools, such as oscilloscopes and logic analyzers, can help identify the root cause of the issue.
  • The ISOW7741BDFMR is designed to provide high immunity to electromagnetic interference (EMI), but it is still essential to follow good design practices to minimize the impact of EMI on the device's performance. This includes using proper shielding, grounding, and filtering, as well as following the recommended PCB layout and routing guidelines. Additionally, the system designer should consider the use of EMI filters or other noise-reduction techniques to minimize the impact of EMI on the system.

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ISOW7741BDFMR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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