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IXBH12N300 - LITTELFUSE

Description: IGBT Transistors DISC IGBT BIMSFT-VERYHIVOLT

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Symbol
IXBH12N300 - LITTELFUSE - PCB symbol
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PCB Footprints
IXBH12N300 - LITTELFUSE PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-247-1
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3D Models
IXBH12N300 - LITTELFUSE - 3D model - Transistor Outline, Vertical - TO-247-1
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IXBH12N300 Details

  • Manufacturer Part Number:

    IXBH12N300

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    3

  • Case Connection:

    COLLECTOR

  • Collector Current-Max (IC):

    30 A

  • Collector-Emitter Voltage-Max:

    3000 V

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • Gate-Emitter Thr Voltage-Max:

    5 V

  • Gate-Emitter Voltage-Max:

    20 V

  • JEDEC-95 Code:

    TO-247AD

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e3

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    160 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Transistor Application:

    POWER CONTROL

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Nom (toff):

    720 ns

  • Turn-on Time-Nom (ton):

    204 ns

  • VCEsat-Max:

    3.2 V

IXBH12N300 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the IXBH12N300 is a standard TO-220 package with a minimum pad size of 70 mil x 70 mil (1.78 mm x 1.78 mm) and a thermal pad size of 100 mil x 100 mil (2.54 mm x 2.54 mm).
  • The IXBH12N300 is rated for operation up to 150°C, but it's recommended to derate the power dissipation at higher temperatures. Consult the datasheet for thermal derating curves and ensure proper heat sinking to prevent overheating.
  • Use a soldering iron with a temperature of 250°C to 270°C, and apply a small amount of solder paste to the pads. Ensure the component is properly aligned and the solder joints are clean and free of oxidation.
  • Store the IXBH12N300 in a dry, cool place away from direct sunlight and moisture. Handle the components by the body, avoiding touching the leads or die. Use anti-static packaging and follow ESD handling procedures to prevent damage.
  • The IXBH12N300 is designed to withstand moderate vibration, but it's recommended to ensure the component is properly secured to the PCB and the PCB is rigidly mounted to prevent mechanical stress.

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IXBH12N300 Overview

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