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IXBH42N170 - LITTELFUSE

Description: Trans IGBT Chip N-CH 1700V 80A 360000mW 3-Pin(3+Tab) TO-247AD

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PCB Footprints
IXBH42N170 - LITTELFUSE PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-247 (IXFH) Outline_2021
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3D Models
IXBH42N170 - LITTELFUSE  - 3D model - Transistor Outline, Vertical - TO-247 (IXFH) Outline_2021
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IXBH42N170 Details

  • Manufacturer Part Number:

    IXBH42N170

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    7

  • Additional Feature:

    LOW CONDUCTION LOSS

  • Case Connection:

    COLLECTOR

  • Collector Current-Max (IC):

    80 A

  • Collector-Emitter Voltage-Max:

    1700 V

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • Gate-Emitter Thr Voltage-Max:

    5.5 V

  • Gate-Emitter Voltage-Max:

    20 V

  • JEDEC-95 Code:

    TO-247AD

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e3

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    360 W

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Transistor Application:

    POWER CONTROL

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Nom (toff):

    1070 ns

  • Turn-on Time-Nom (ton):

    224 ns

  • VCEsat-Max:

    2.8 V

IXBH42N170 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the IXBH42N170 is a TO-220AB package with a minimum pad size of 3.5mm x 2.5mm and a thermal pad size of 2.5mm x 2.5mm.
  • To ensure reliable operation in high-temperature environments, it is recommended to derate the device's current and voltage ratings according to the datasheet's thermal derating curve, and to provide adequate heat sinking and thermal management.
  • The maximum allowed lead temperature for the IXBH42N170 is 300°C for a maximum of 10 seconds during soldering.
  • Yes, the IXBH42N170 can be used in a parallel configuration to increase current handling, but it is recommended to ensure that the devices are matched in terms of their electrical characteristics and that the current sharing is balanced to prevent overheating.
  • The recommended storage temperature range for the IXBH42N170 is -40°C to 125°C.

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IXBH42N170 Overview

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