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IXBH42N250 - LITTELFUSE

Description: IGBT Transistors DISC IGBT BIMSFT-VERYHIVOLT

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Symbol
IXBH42N250 - LITTELFUSE - PCB symbol
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PCB Footprints
IXBH42N250 - LITTELFUSE PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-247_(IXBH)
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3D Models
IXBH42N250 - LITTELFUSE - 3D model - Transistor Outline, Vertical - TO-247_(IXBH)
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IXBH42N250 Details

  • Manufacturer Part Number:

    IXBH42N250

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    6

  • Case Connection:

    COLLECTOR

  • Collector Current-Max (IC):

    104 A

  • Collector-Emitter Voltage-Max:

    2500 V

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • Gate-Emitter Thr Voltage-Max:

    5 V

  • Gate-Emitter Voltage-Max:

    25 V

  • JEDEC-95 Code:

    TO-247AD

  • JESD-30 Code:

    R-PSFM-T3

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    500 W

  • Surface Mount:

    NO

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Transistor Application:

    POWER CONTROL

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Nom (toff):

    950 ns

  • Turn-on Time-Nom (ton):

    652 ns

  • VCEsat-Max:

    3 V

IXBH42N250 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the IXBH42N250 is a standard TO-247 package with a minimum pad size of 5.5mm x 3.5mm and a thermal pad size of 3.5mm x 3.5mm.
  • Yes, the IXBH42N250 is designed for high-reliability applications and meets the requirements of AEC-Q101, a standard for automotive-grade components.
  • To ensure proper cooling, a heat sink with a thermal resistance of less than 1°C/W is recommended. Additionally, the device should be mounted on a PCB with a thermal vias and a copper pour to dissipate heat effectively.
  • The maximum allowed case temperature for the IXBH42N250 is 150°C, as specified in the datasheet.
  • Yes, the IXBH42N250 can be used in a parallel configuration to increase current handling, but it is essential to ensure that the devices are properly matched and that the current sharing is balanced to avoid overheating and premature failure.

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IXBH42N250 Overview

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