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IXBK75N170 - LITTELFUSE

Description: Trans IGBT Chip N-CH 1700V 200A 1040W 3-Pin(3+Tab) TO-264

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Symbol
IXBK75N170 - LITTELFUSE - PCB symbol
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PCB Footprints
IXBK75N170 - LITTELFUSE PCB footprint - Other - Other - TO-264 (IXBK)
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3D Models
IXBK75N170 - LITTELFUSE - 3D model - Other - TO-264 (IXBK)
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IXBK75N170 Details

  • Manufacturer Part Number:

    IXBK75N170

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    7

  • Case Connection:

    COLLECTOR

  • Collector Current-Max (IC):

    200 A

  • Collector-Emitter Voltage-Max:

    1700 V

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • Gate-Emitter Thr Voltage-Max:

    5.5 V

  • Gate-Emitter Voltage-Max:

    20 V

  • JEDEC-95 Code:

    TO-264AA

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    1040 W

  • Surface Mount:

    NO

  • Terminal Finish:

    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Transistor Application:

    POWER CONTROL

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Nom (toff):

    840 ns

  • Turn-on Time-Nom (ton):

    277 ns

  • VCEsat-Max:

    3.1 V

IXBK75N170 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the IXBK75N170 is a standard TO-220 package with a minimum pad size of 0.2 inches (5 mm) x 0.15 inches (3.8 mm) and a thermal pad size of 0.2 inches (5 mm) x 0.2 inches (5 mm).
  • Yes, the IXBK75N170 is qualified to AEC-Q101 standards, making it suitable for high-reliability and automotive applications. However, for aerospace applications, additional testing and qualification may be required.
  • To ensure proper soldering, follow the recommended soldering profile: peak temperature of 260°C (500°F), dwell time of 10-30 seconds, and a soldering iron temperature of 350°C (662°F). Use a solder with a melting point of 217°C (423°F) or higher.
  • The IXBK75N170 can withstand voltage transients up to 1.5 times the maximum rated voltage (170V) for a duration of 100 microseconds or less.
  • Yes, the IXBK75N170 can be used in a parallel configuration to increase current handling. However, ensure that the devices are matched for voltage and current ratings, and that the PCB design and thermal management are adequate to handle the increased power dissipation.

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IXBK75N170 Overview

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