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IXGH6N170A - LITTELFUSE

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IXGH6N170A - LITTELFUSE  - 3D model
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IXGH6N170A Details

  • Manufacturer Part Number:

    IXGH6N170A

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Reach Compliance Code:

    Not Compliant

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    7

  • Case Connection:

    COLLECTOR

  • Collector Current-Max (IC):

    6 A

  • Collector-Emitter Voltage-Max:

    1700 V

  • Configuration:

    SINGLE

  • Fall Time-Max (tf):

    65 ns

  • Gate-Emitter Thr Voltage-Max:

    5 V

  • Gate-Emitter Voltage-Max:

    20 V

  • JEDEC-95 Code:

    TO-247AD

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e3

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    75 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Transistor Application:

    POWER CONTROL

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Nom (toff):

    271 ns

  • Turn-on Time-Nom (ton):

    91 ns

IXGH6N170A Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for IXGH6N170A is a standard TO-247 package with a minimum pad size of 2.5mm x 2.5mm and a thermal pad size of 4.5mm x 4.5mm.
  • To ensure reliable soldering, use a soldering iron with a temperature range of 250°C to 260°C, and apply a solder flux to the pins. Avoid applying excessive force or pressure to the pins during soldering.
  • The maximum allowed case temperature for IXGH6N170A is 150°C, as specified in the datasheet. Exceeding this temperature may affect the device's reliability and performance.
  • Yes, IXGH6N170A is suitable for high-frequency switching applications up to 100 kHz. However, it's essential to consider the device's switching losses, gate drive requirements, and thermal management to ensure reliable operation.
  • To protect IXGH6N170A from ESD, handle the device with an anti-static wrist strap or mat, and ensure that the PCB and components are properly grounded. Avoid touching the pins or exposed metal surfaces during handling.

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IXGH6N170A Overview

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