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IXYP30N120C3 - LITTELFUSE

Description: 1200V 75A 500W TO220AB

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Symbol
IXYP30N120C3 - LITTELFUSE - PCB symbol
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PCB Footprints
IXYP30N120C3 - LITTELFUSE PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-220 (IXFP)
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3D Models
IXYP30N120C3 - LITTELFUSE - 3D model - Transistor Outline, Vertical - TO-220 (IXFP)
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IXYP30N120C3 Details

  • Manufacturer Part Number:

    IXYP30N120C3

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    5.35

  • Case Connection:

    COLLECTOR

  • Collector Current-Max (IC):

    75 A

  • Collector-Emitter Voltage-Max:

    1200 V

  • Configuration:

    SINGLE

  • Gate-Emitter Thr Voltage-Max:

    5 V

  • Gate-Emitter Voltage-Max:

    20 V

  • JEDEC-95 Code:

    TO-220AB

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    500 W

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Transistor Application:

    POWER CONTROL

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Nom (toff):

    296 ns

  • Turn-on Time-Nom (ton):

    71 ns

  • VCEsat-Max:

    3.3 V

IXYP30N120C3 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the IXYP30N120C3 is a standard TO-247 package with a minimum pad size of 5.5mm x 3.5mm and a thermal pad size of 10mm x 10mm.
  • Yes, the IXYP30N120C3 is a high-reliability device that meets the requirements of AEC-Q101, making it suitable for use in automotive and other high-reliability applications.
  • To ensure proper cooling, the IXYP30N120C3 should be mounted on a heat sink with a thermal resistance of less than 1°C/W. Additionally, the device should be placed in a location with good airflow to help dissipate heat.
  • The maximum allowed case temperature for the IXYP30N120C3 is 150°C, as specified in the datasheet.
  • Yes, the IXYP30N120C3 can be used in a parallel configuration to increase current handling, but it is recommended to consult with a Littelfuse application engineer to ensure proper design and layout to minimize current imbalance and thermal issues.

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IXYP30N120C3 Overview

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