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JM38510/05553BEA - Texas Instruments

Description: Maximum Input Current of 1 µA at 18 V Over Full 100% Tested for Quiescent Current at 20 V

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JM38510/05553BEA - Texas Instruments PCB footprint - Ceramic Dual-In-Line Packages - Ceramic Dual-In-Line Packages - J(R-GDIP-T16)
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JM38510/05553BEA - Texas Instruments  - 3D model - Ceramic Dual-In-Line Packages - J(R-GDIP-T16)
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JM38510/05553BEA Details

  • Manufacturer Part Number:

    JM38510/05553BEA

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DIP

  • Pin Count:

    16

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Family:

    4000/14000/40000

  • JESD-30 Code:

    R-GDIP-T16

  • JESD-609 Code:

    e0

  • Length:

    19.05 mm

  • Logic IC Type:

    BUFFER

  • Max I(ol):

    0.018 A

  • Number of Functions:

    6

  • Number of Inputs:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    CERAMIC, GLASS-SEALED

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP16,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Power Supply Current-Max (ICC):

    0.6 mA

  • Propagation Delay (tpd):

    120 ns

  • Qualification Status:

    Not Qualified

  • Screening Level:

    MIL-M-38510 Class B

  • Seated Height-Max:

    5.08 mm

  • Supply Voltage-Max (Vsup):

    18 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    10 V

  • Surface Mount:

    NO

  • Technology:

    CMOS

  • Temperature Grade:

    MILITARY

  • Terminal Finish:

    Tin/Lead (Sn/Pb)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Width:

    7.62 mm

JM38510/05553BEA Frequently Asked Questions (FAQs)

  • The recommended operating temperature range for JM38510/05553BEA is -55°C to 125°C, as specified in the datasheet. However, it's essential to note that the device's performance and reliability may degrade if operated outside this range for extended periods.
  • To ensure the reliability of JM38510/05553BEA in high-reliability applications, it's crucial to follow proper design, manufacturing, and testing procedures. This includes adhering to Texas Instruments' recommended operating conditions, using proper PCB layout and thermal management, and performing thorough testing and validation.
  • JM38510/05553BEA is not specifically designed or tested for radiation hardness. If you need a radiation-hardened device, you should consider using a different part that is specifically designed and qualified for such applications.
  • The maximum power dissipation for JM38510/05553BEA is not explicitly stated in the datasheet. However, you can calculate the maximum power dissipation based on the device's thermal resistance, junction temperature, and package type. It's essential to ensure that the device operates within its thermal limits to prevent overheating and reliability issues.
  • Yes, there are specific PCB layout considerations for JM38510/05553BEA. It's essential to follow proper PCB design practices, such as using a solid ground plane, minimizing trace lengths, and avoiding noise-sensitive areas near the device. Additionally, ensure that the PCB material and thickness meet the recommended specifications.

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JM38510/05553BEA Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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