K4F6E3S4HM-MGCJ - SAMSUNG

K4F6E3S4HM-MGCJ Details

• Manufacturer Part Number:

  K4F6E3S4HM-MGCJ

• Rohs Code:

  Yes

• Part Life Cycle Code:

  End Of Life

• Package Description:

  FBGA-200

• ECCN Code:

  EAR99

• HTS Code:

  8542.32.00.36

• Manufacturer:

  Samsung Electro-Mechanics

• YTEOL:

  0

• Clock Frequency-Max (fCLK):

  1867 MHz

• I/O Type:

  COMMON

• JESD-30 Code:

  R-PBGA-B200

• Length:

  14.5 mm

• Memory Density:

  17179869184 bit

• Memory IC Type:

  LPDDR4 DRAM

• Memory Width:

  32

• Number of Functions:

  1

• Number of Ports:

  1

• Number of Terminals:

  200

• Number of Words:

  536870912 words

• Number of Words Code:

  512000000

• Operating Mode:

  ASYNCHRONOUS

• Operating Temperature-Max:

  85 °C

• Operating Temperature-Min:

  -25 °C

• Organization:

  512MX32

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  TFBGA

• Package Equivalence Code:

  BGA200,12X22,32/25

• Package Shape:

  RECTANGULAR

• Package Style:

  GRID ARRAY, THIN PROFILE, FINE PITCH

• Refresh Cycles:

  8192

• Seated Height-Max:

  1.1 mm

• Self Refresh:

  YES

• Supply Voltage-Nom (Vsup):

  1.1 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Temperature Grade:

  OTHER

• Terminal Form:

  BALL

• Terminal Pitch:

  0.65 mm

• Terminal Position:

  BOTTOM

• Width:

  10 mm