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K4U6E3S4AA-MGCL - SAMSUNG

Description: FBGA-200 DDR SDRAM ROHS LPDDR4X-4266MHz x32 (16GB) DRAM Memory Chip

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Symbol

K4U6E3S4AA-MGCL - SAMSUNG - PCB symbol

PCB Footprints

K4U6E3S4AA-MGCL - SAMSUNG PCB footprint - BGA - BGA - 200-Ball Fine pitch Ball Grid Array

3D Models

K4U6E3S4AA-MGCL - SAMSUNG - 3D model - BGA - 200-Ball Fine pitch Ball Grid Array

Datasheet Download Datasheet
Stock & Prices Price & Stock for K4U6E3S4AA-MGCL
Part Number K4U6E3S4AA-MGCL
Manufacturer SAMSUNG
Pin Count 200
Part Category Integrated Circuit
Package Category BGA
Footprint Name BGA - 200-Ball Fine pitch Ball Grid Array
Released Date Feb 25, 2025
Last Modified Date Feb 25, 2025 2:05 PM UTC
Pinout / Pin List Click Here (Member Only)

K4U6E3S4AA-MGCL Details

Manufacturer Part Number:
K4U6E3S4AA-MGCL
Manufacturer:
Samsung Electro-Mechanics

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K4U6E3S4AA-MGCL Overview

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