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K4UCE3Q4AB-MGCL - SAMSUNG

Description: 200-Ball Fine pitch Ball Grid Array1.8 / 1.1 / 0.6 V. Temperature: -25 ~ 85 °C FBGA-200.

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Symbol

K4UCE3Q4AB-MGCL - SAMSUNG - PCB symbol

PCB Footprints

K4UCE3Q4AB-MGCL - SAMSUNG PCB footprint - BGA - BGA - 200-Ball Fine pitch Ball Grid Array Package_2024

3D Models

K4UCE3Q4AB-MGCL - SAMSUNG - 3D model - BGA - 200-Ball Fine pitch Ball Grid Array Package_2024

Datasheet Download Datasheet
Stock & Prices Price & Stock for K4UCE3Q4AB-MGCL
Part Number K4UCE3Q4AB-MGCL
Manufacturer SAMSUNG
Pin Count 200
Part Category Integrated Circuit
Package Category BGA
Footprint Name BGA - 200-Ball Fine pitch Ball Grid Array Package_2024
Released Date Oct 27, 2024
Last Modified Date Oct 27, 2024 9:22 AM UTC
Pinout / Pin List Click Here (Member Only)

K4UCE3Q4AB-MGCL Details

Manufacturer Part Number:
K4UCE3Q4AB-MGCL
Manufacturer:
Samsung Electro-Mechanics

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