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KLMBG4GESD-B03P - SAMSUNG

Description: eMMC 5.0, Density 32 GB, Voltage 1.8/3.3 V, Interface HS400, Package Size 11.5x13x1.0mm,Temp. -40~85°C

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KLMBG4GESD-B03P - SAMSUNG - PCB symbol
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PCB Footprints
KLMBG4GESD-B03P - SAMSUNG PCB footprint - BGA - BGA - 11.5mm x 13mm x 1.0mm Package Dimension
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3D Models
KLMBG4GESD-B03P - SAMSUNG - 3D model - BGA - 11.5mm x 13mm x 1.0mm Package Dimension
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KLMBG4GESD-B03P Details

  • Manufacturer Part Number:

    KLMBG4GESD-B03P

  • Manufacturer:

    Samsung Electro-Mechanics

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