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L6219DSA13TR - STMicroelectronics

Description: Stepper Motor Controller 24-Pin SO T/R

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L6219DSA13TR - STMicroelectronics - PCB symbol
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L6219DSA13TR - STMicroelectronics PCB footprint - Small Outline Packages - Small Outline Packages - SO24
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L6219DSA13TR - STMicroelectronics - 3D model - Small Outline Packages - SO24
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L6219DSA13TR Details

  • Manufacturer Part Number:

    L6219DSA13TR

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC

  • Package Description:

    SO-24

  • Pin Count:

    24

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    0

  • Analog IC - Other Type:

    STEPPER MOTOR CONTROLLER

  • JESD-30 Code:

    R-PDSO-G24

  • Length:

    15.4 mm

  • Number of Functions:

    1

  • Number of Terminals:

    24

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    1 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.65 mm

  • Supply Voltage-Max (Vsup):

    5.25 V

  • Supply Voltage-Min (Vsup):

    4.75 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Width:

    7.5 mm

L6219DSA13TR Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the L6219DSA13TR is -40°C to 150°C, as specified in the datasheet. However, it's recommended to operate the device within a temperature range of -20°C to 125°C for optimal performance and reliability.
  • To ensure proper thermal management, it's essential to provide a good thermal path from the device to a heat sink or the PCB. Use a thermal interface material (TIM) with a thermal conductivity of at least 1 W/mK, and ensure the heat sink is properly attached to the device. Additionally, consider using thermal vias and a thermal pad on the PCB to improve heat dissipation.
  • For optimal performance and thermal management, it's recommended to follow a 4-layer PCB stack-up with a dedicated power plane, a dedicated ground plane, and two signal layers. Keep the power traces as short and wide as possible, and use a solid ground plane to reduce electromagnetic interference (EMI).
  • To handle the high current output of the L6219DSA13TR, use a PCB with a sufficient copper thickness (at least 2 oz) and a wide enough trace width (at least 1 mm) to minimize voltage drops and heat generation. Additionally, consider using a current sense resistor and a fuse or a PTC (Positive Temperature Coefficient) thermistor to protect the device and the PCB from overcurrent conditions.
  • To minimize EMI, use a shielded enclosure, and ensure the PCB is properly grounded. Keep the power traces and signal traces as short as possible, and use a common-mode choke or a ferrite bead to filter out high-frequency noise. Additionally, consider using a snubber network or a damping resistor to reduce ringing and oscillations.

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L6219DSA13TR Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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