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L99PM72GXP - STMicroelectronics

Description: Power Management IC to Automotive AEC-Q100 36-Pin PowerSSO EP Tube

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PCB Footprints
L99PM72GXP - STMicroelectronics PCB footprint - Small Outline Packages - Small Outline Packages - PowerSSO 36
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3D Models
L99PM72GXP - STMicroelectronics  - 3D model - Small Outline Packages - PowerSSO 36
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L99PM72GXP Details

  • Manufacturer Part Number:

    L99PM72GXP

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    POWERSSO-36

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    3

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    VOLTAGE SUPERVISOR/RESET IC

  • JESD-30 Code:

    R-PDSO-G36

  • JESD-609 Code:

    e3

  • Length:

    10.3 mm

  • Moisture Sensitivity Level:

    3

  • Number of Channels:

    12

  • Number of Functions:

    1

  • Number of Terminals:

    36

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HSSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    2.45 mm

  • Supply Voltage-Max (Vsup):

    28 V

  • Supply Voltage-Min (Vsup):

    4.5 V

  • Supply Voltage-Nom (Vsup):

    12 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Width:

    7.5 mm

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L99PM72GXP Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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