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LAN8700iC-AEZG - Microchip

Description: ESD Protected MII/RMII 10/100 Tx/Rx,Ind Microchip LAN8700IC-AEZG, IEEE 802.3ab Physical Layer Transceiver, 3.3 V, 36-Pin QFN

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LAN8700iC-AEZG - Microchip PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - 36-Pin QFN_2
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LAN8700iC-AEZG - Microchip  - 3D model - Quad Flat No-Lead - 36-Pin QFN_2
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LAN8700iC-AEZG Details

  • Manufacturer Part Number:

    LAN8700IC-AEZG

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFN

  • Package Description:

    6 X 6 MM, 0.90 MM HEIGHT, ROHS COMPLIANT, QFN-36

  • Pin Count:

    36

  • Manufacturer Package Code:

    VQFN-36

  • Country Of Origin:

    Mainland China, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    7 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Boundary Scan:

    NO

  • Clock Frequency-Max:

    25 MHz

  • Communication Protocol:

    SYNC, BYTE; ETHERNET

  • Data Encoding/Decoding Method:

    NRZI; BIPH-LEVEL(MANCHESTER)

  • Data Transfer Rate-Max:

    12.5 MBps

  • JESD-30 Code:

    S-PQCC-N36

  • JESD-609 Code:

    e3

  • Length:

    6 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    3

  • Number of Serial I/Os:

    4

  • Number of Terminals:

    36

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC36,.24SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    1 mm

  • Supply Current-Max:

    41.3 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    6 mm

  • uPs/uCs/Peripheral ICs Type:

    SERIAL IO/COMMUNICATION CONTROLLER, LAN

LAN8700iC-AEZG Frequently Asked Questions (FAQs)

  • Microchip provides a recommended PCB layout guide in their application note AN2054, which includes guidelines for component placement, routing, and thermal management.
  • The LAN8700IC-AEZG is a PHY device that supports various Ethernet protocols. Configuration is typically done through the Serial Management Interface (SMI) or the Media Independent Interface (MII). Refer to the datasheet and application notes for specific configuration details.
  • The LAN8700IC-AEZG has a typical power consumption of 350mW in 1000BASE-T mode. Thermal characteristics include a junction temperature range of -40°C to 125°C and a thermal resistance of 25°C/W. Refer to the datasheet for more detailed information.
  • Microchip provides a troubleshooting guide in their application note AN2055, which covers common issues and debugging techniques for the LAN8700IC-AEZG.
  • Yes, the LAN8700IC-AEZG is a high-speed digital device that requires careful attention to EMI/EMC considerations. Refer to the datasheet and application notes for guidelines on PCB layout, shielding, and filtering to minimize EMI/EMC issues.

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LAN8700iC-AEZG Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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