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LAS2G101MELZ25 - Nichicon

Description: Aluminum Electrolytic Capacitors - Snap In 400V 100UF 20%

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LAS2G101MELZ25 - Nichicon  - 3D model
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LAS2G101MELZ25 Details

  • Manufacturer Part Number:

    LAS2G101MELZ25

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Japan

  • ECCN Code:

    EAR99

  • HTS Code:

    8532.22.00.40

  • Manufacturer:

    Nichicon Corporation

  • YTEOL:

    6

  • Capacitance:

    100 µF

  • Capacitor Type:

    ALUMINUM ELECTROLYTIC CAPACITOR

  • Diameter:

    22 mm

  • Dielectric Material:

    ALUMINUM (WET)

  • Leakage Current:

    0.6 mA

  • Length:

    25 mm

  • Mounting Feature:

    THROUGH HOLE MOUNT

  • Negative Tolerance:

    20%

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -25 °C

  • Package Style:

    Snap-in

  • Packing Method:

    Bulk

  • Polarity:

    POLARIZED

  • Positive Tolerance:

    20%

  • Rated (DC) Voltage (URdc):

    400 V

  • Ripple Current:

    680 mA

  • Surface Mount:

    NO

  • Tan Delta:

    0.2

  • Terminal Pitch:

    10 mm

  • Terminal Shape:

    SNAP-IN

LAS2G101MELZ25 Frequently Asked Questions (FAQs)

  • The recommended soldering temperature for LAS2G101MELZ25 is 260°C (500°F) for 10 seconds or less, to prevent damage to the capacitor.
  • Yes, LAS2G101MELZ25 is designed to withstand vibrations up to 10Hz to 200Hz, 1.5mm double amplitude, and can be used in high-vibration environments with proper mounting and installation.
  • LAS2G101MELZ25 is rated for operation up to 125°C, but its capacitance and ESR may degrade at high temperatures. Consult the datasheet for derating information and consider using a capacitor with a higher temperature rating if necessary.
  • Yes, LAS2G101MELZ25 is designed for high-reliability applications and meets the requirements of various industry standards, including IEC 60384-4 and JIS C 5101-4.
  • Yes, LAS2G101MELZ25 is designed to withstand humid environments and meets the requirements of IEC 60384-4 for humidity testing. However, it's still important to follow proper storage and handling procedures to prevent moisture absorption.

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LAS2G101MELZ25 Overview

Use the download button to access the LAS2G101MELZ25 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
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Part Image B43508A9107M082 TDK Corporation

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For a full list of alternate parts for LAS2G101MELZ25, check out Findchips.com