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LB11988V-TLM-E - onsemi

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LB11988V-TLM-E - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - SSOP24J(275mil)
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LB11988V-TLM-E - onsemi  - 3D model - Small Outline Packages - SSOP24J(275mil)
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LB11988V-TLM-E Details

  • Manufacturer Part Number:

    LB11988V-TLM-E

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SSOP24J (275mil)

  • Package Description:

    0.275 INCH, SSOP-24

  • Pin Count:

    24

  • Manufacturer Package Code:

    565AS

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Additional Feature:

    OUTPUT BLOCK POWER SUPPLY IS 5 TO 22

  • Analog IC - Other Type:

    STEPPER MOTOR CONTROLLER

  • JESD-30 Code:

    R-PDSO-G24

  • JESD-609 Code:

    e6

  • Length:

    9.75 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    24

  • Operating Temperature-Max:

    75 °C

  • Operating Temperature-Min:

    -30 °C

  • Output Current-Max:

    1.3 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Equivalence Code:

    SOP24,.3,32

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.5 mm

  • Supply Current-Max (Isup):

    24 mA

  • Supply Voltage-Max (Vsup):

    22 V

  • Supply Voltage-Min (Vsup):

    7 V

  • Supply Voltage-Nom (Vsup):

    12 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    COMMERCIAL EXTENDED

  • Terminal Finish:

    TIN BISMUTH

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    5.6 mm

LB11988V-TLM-E Frequently Asked Questions (FAQs)

  • A recommended PCB layout for optimal thermal performance would be to use a 2-layer or 4-layer board with a solid ground plane, and to place thermal vias under the IC to dissipate heat efficiently. Additionally, it's recommended to keep the PCB traces as short and wide as possible to reduce thermal resistance.
  • To ensure reliable operation in high-temperature environments, it's essential to follow proper thermal design and layout guidelines, such as using a heat sink or thermal interface material, and ensuring good airflow around the device. Additionally, consider using a thermistor or temperature sensor to monitor the device temperature and implement thermal protection mechanisms if necessary.
  • Although the datasheet specifies the recommended operating voltage range, it's essential to note that the maximum allowed voltage on the input pins is typically 5.5V, and exceeding this voltage may cause damage to the device. It's recommended to use voltage limiting resistors or clamping diodes to protect the input pins from overvoltage conditions.
  • To troubleshoot issues with the device not turning on or not functioning properly, first check the power supply voltage and ensure it's within the recommended range. Verify that the input pins are properly connected and not shorted to ground or VCC. Also, check for any signs of physical damage, such as cracks or burn marks, and ensure that the device is properly soldered to the PCB.
  • The recommended storage temperature range for the LB11988V-TLM-E is typically between -40°C and 125°C, and the recommended storage humidity range is 60% RH or less. It's essential to follow these guidelines to prevent damage to the device during storage and to ensure reliable operation when the device is put into use.

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