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LC4064ZE-4MN64C - Lattice Semiconductor

Description: CPLD ispMACH® 4000ZE Family 64 Macro Cells 241MHz 1.8V 64-Pin CSBGA Tray

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PCB Footprints
LC4064ZE-4MN64C - Lattice Semiconductor PCB footprint - BGA - BGA - 64-Ball csBGA
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3D Models
LC4064ZE-4MN64C - Lattice Semiconductor  - 3D model - BGA - 64-Ball csBGA
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LC4064ZE-4MN64C Details

  • Manufacturer Part Number:

    LC4064ZE-4MN64C

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    BGA

  • Package Description:

    5 X 5 MM, 0.5 MM PITCH, LEAD FREE, CSBGA-64

  • Pin Count:

    64

  • Country Of Origin:

    Malaysia, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Lattice Semiconductor Corporation

  • YTEOL:

    5

  • Additional Feature:

    YES

  • Clock Frequency-Max:

    175 MHz

  • In-System Programmable:

    YES

  • JESD-30 Code:

    S-PBGA-B64

  • JESD-609 Code:

    e1

  • JTAG BST:

    YES

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    3

  • Number of Dedicated Inputs:

    4

  • Number of I/O Lines:

    48

  • Number of Inputs:

    52

  • Number of Macro Cells:

    64

  • Number of Outputs:

    48

  • Number of Terminals:

    64

  • Operating Temperature-Max:

    90 °C

  • Organization:

    4 DEDICATED INPUTS, 48 I/O

  • Output Function:

    MACROCELL

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TFBGA

  • Package Equivalence Code:

    BGA64,8X8,20

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Programmable Logic Type:

    EE PLD

  • Propagation Delay:

    4.7 ns

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Supply Voltage-Max:

    1.9 V

  • Supply Voltage-Min:

    1.7 V

  • Supply Voltage-Nom:

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    TIN SILVER COPPER

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    5 mm

LC4064ZE-4MN64C Frequently Asked Questions (FAQs)

  • The recommended power-up sequence is to apply VCCIO first, followed by VCC, and then the input signals. This ensures that the device powers up correctly and minimizes the risk of latch-up or damage.
  • To implement a reliable JTAG boundary scan chain, ensure that the TCK pin is connected to a clock source, and the TMS, TDI, and TDO pins are connected to the corresponding pins on the next device in the chain. Also, make sure to follow the IEEE 1149.1 standard for JTAG boundary scan.
  • The maximum frequency of operation for the LC4064ZE-4MN64C is 150 MHz, but this can vary depending on the specific application, operating conditions, and device configuration. It's recommended to consult the datasheet and perform simulations to determine the maximum frequency for a specific design.
  • To optimize the LC4064ZE-4MN64C for low power consumption, use the lowest possible voltage supply, minimize clock frequency, and use the device's built-in power-saving features such as the 'sleep' mode. Additionally, consider using a low-power FPGA design flow and optimizing the design for low power consumption.
  • The recommended PCB layout and routing strategy for the LC4064ZE-4MN64C involves using a multi-layer PCB with a solid ground plane, separating analog and digital signals, and using controlled impedance routing for high-speed signals. It's also recommended to follow the datasheet's guidelines for pin placement and routing.

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