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LC4256V-75TN176C - Lattice Semiconductor

Description: IC CPLD 256MC 7.5NS 176TQFP 3.3 V/2.5 V/1.8 V In-System Programmable SuperFAST High Density PLDs

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LC4256V-75TN176C - Lattice Semiconductor PCB footprint - Quad Flat Packages - Quad Flat Packages - 176-Pin TQFP Package
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LC4256V-75TN176C - Lattice Semiconductor  - 3D model - Quad Flat Packages - 176-Pin TQFP Package
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LC4256V-75TN176C Details

  • Manufacturer Part Number:

    LC4256V-75TN176C

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFP

  • Package Description:

    TQFP-176

  • Pin Count:

    176

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Lattice Semiconductor Corporation

  • YTEOL:

    10

  • Architecture:

    PAD-TYPE

  • Clock Frequency-Max:

    111 MHz

  • In-System Programmable:

    YES

  • JESD-30 Code:

    S-PQFP-G176

  • JESD-609 Code:

    e3

  • JTAG BST:

    YES

  • Length:

    21 mm

  • Moisture Sensitivity Level:

    3

  • Number of Dedicated Inputs:

    4

  • Number of I/O Lines:

    128

  • Number of Inputs:

    132

  • Number of Macro Cells:

    256

  • Number of Outputs:

    128

  • Number of Product Terms:

    83

  • Number of Terminals:

    176

  • Operating Temperature-Max:

    90 °C

  • Organization:

    4 DEDICATED INPUTS, 128 I/O

  • Output Function:

    MACROCELL

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFQFP

  • Package Equivalence Code:

    QFP176,1.0SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Programmable Logic Type:

    EE PLD

  • Propagation Delay:

    7.5 ns

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.6 mm

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    21 mm

LC4256V-75TN176C Frequently Asked Questions (FAQs)

  • The recommended power-up sequence is to apply VCCIO first, followed by VCCINT, and then VREF. This ensures that the internal voltage regulators are powered up correctly.
  • To implement a reliable JTAG interface, ensure that the TCK clock frequency is within the recommended range (1-10 MHz), and use a high-quality JTAG cable with proper termination. Also, ensure that the JTAG pins are not shared with other functions.
  • For optimal performance, follow these guidelines: keep signal traces short and direct, use a solid ground plane, and avoid crossing signal traces over each other. Also, ensure that the power and ground pins are connected to a low-impedance power plane.
  • To handle thermal management, ensure good airflow around the device, use a heat sink if necessary, and avoid blocking the thermal pads on the package. Also, follow the recommended thermal design guidelines in the datasheet.
  • For high-reliability or high-temperature applications, consider using a device with a higher temperature rating, and ensure that the device is properly derated for the operating conditions. Also, follow the recommended design guidelines for high-reliability applications.

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