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LC709204FXE-01TBG - onsemi

Description: I2C interface(up to 400kHz supported); High accuracy gauging; Low power consumption; Stable gauging; Small footprint; Alarm function: RSOC / Voltage / Temperature; Battery lifetime measurement; Multi-thermistor support

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LC709204FXE-01TBG - onsemi PCB footprint - BGA - BGA - WLCSP12, 1.48x1.91x0.51
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LC709204FXE-01TBG - onsemi  - 3D model - BGA - WLCSP12, 1.48x1.91x0.51
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LC709204FXE-01TBG Details

  • Manufacturer Part Number:

    LC709204FXE-01TBG

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    WLCSP12, 1.48x1.91x0.51

  • Manufacturer Package Code:

    567XE

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    BATTERY GAUGE

  • JESD-30 Code:

    R-PBGA-B12

  • JESD-609 Code:

    e1

  • Length:

    1.91 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    12

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA12,3X4,16

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.51 mm

  • Supply Voltage-Max (Vsup):

    5 V

  • Supply Voltage-Min (Vsup):

    2.5 V

  • Supply Voltage-Nom (Vsup):

    4 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.48 mm

LC709204FXE-01TBG Frequently Asked Questions (FAQs)

  • A good PCB layout for the LC709204FXE-01TBG involves keeping the input and output capacitors close to the device, using a solid ground plane, and minimizing the length of the traces to reduce parasitic inductance and capacitance.
  • To ensure proper power-up and initialization, make sure to follow the recommended power-up sequence, provide a stable input voltage, and allow sufficient time for the device to settle before enabling the output.
  • To prevent overheating, ensure good airflow around the device, use a heat sink if necessary, and follow the recommended thermal design guidelines. Monitor the device's junction temperature and adjust the operating conditions accordingly.
  • To troubleshoot issues, start by verifying the input voltage, checking the output voltage and current, and ensuring the device is properly configured. Use oscilloscopes and other diagnostic tools to identify the root cause of the issue.
  • Yes, to minimize EMI/EMC issues, use a shielded enclosure, keep the device away from noise sources, and follow proper PCB layout and grounding techniques. Ensure the device is properly decoupled and filtered to reduce emissions.

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LC709204FXE-01TBG Overview

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