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LCMXO2-1200ZE-3SG32C - Lattice Semiconductor

Description: MachXO2 Field Programmable Gate Array (FPGA) IC 32-UFQFN Exposed Pad

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LCMXO2-1200ZE-3SG32C - Lattice Semiconductor PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - 3SG32C
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LCMXO2-1200ZE-3SG32C - Lattice Semiconductor  - 3D model - Quad Flat No-Lead - 3SG32C
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LCMXO2-1200ZE-3SG32C Details

  • Manufacturer Part Number:

    LCMXO2-1200ZE-3SG32C

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Date Of Intro:

    2016-03-11

  • Manufacturer:

    Lattice Semiconductor Corporation

  • YTEOL:

    19

  • Clock Frequency-Max:

    87 MHz

  • JESD-30 Code:

    S-XQCC-N32

  • JESD-609 Code:

    e3

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    3

  • Number of CLBs:

    160

  • Number of Inputs:

    21

  • Number of Logic Cells:

    1280

  • Number of Outputs:

    21

  • Number of Terminals:

    32

  • Operating Temperature-Max:

    85 °C

  • Organization:

    160 CLBS

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC32,.2SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Packing Method:

    TRAY

  • Peak Reflow Temperature (Cel):

    260

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max:

    1.26 V

  • Supply Voltage-Min:

    1.14 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    5 mm

LCMXO2-1200ZE-3SG32C Frequently Asked Questions (FAQs)

  • Lattice Semiconductor provides a PCB Design and Layout Guide document that provides recommendations for PCB layout and routing for their FPGAs, including the LCMXO2-1200ZE-3SG32C. This document can be found on the Lattice website.
  • Lattice recommends following a specific power-up sequence to ensure reliable operation of the FPGA. This sequence involves powering up the core voltage (VCC) before the I/O voltage (VCCIO), and then releasing the reset signal. More details can be found in the FPGA's datasheet and user manual.
  • The LCMXO2-1200ZE-3SG32C has a maximum junction temperature of 125°C. To ensure reliable operation, it's essential to provide adequate thermal management, such as using a heat sink or thermal pad, and ensuring good airflow around the device. Lattice provides thermal management guidelines in their documentation.
  • Lattice provides a variety of tools and resources to help optimize FPGA performance and power consumption, including the Lattice Diamond software, which offers power analysis and optimization features. Additionally, Lattice's documentation provides guidelines for optimizing clocking, routing, and other design parameters.
  • The LCMXO2-1200ZE-3SG32C is a commercial-grade FPGA and is not specifically designed for radiation-tolerant or high-reliability applications. However, Lattice provides some information on the FPGA's radiation tolerance and reliability characteristics in their documentation, and can also provide additional information upon request.

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LCMXO2-1200ZE-3SG32C Overview

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