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LCMXO2-4000ZE-1FTG256I - Lattice Semiconductor

Description: FPGA - Field Programmable Gate Array 4320 LUTs 207 IO 1.2V 1 Spd

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LCMXO2-4000ZE-1FTG256I - Lattice Semiconductor PCB footprint - BGA - BGA - 256-Ball ftBGA Package Option 3: MachXO2
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LCMXO2-4000ZE-1FTG256I - Lattice Semiconductor  - 3D model - BGA - 256-Ball ftBGA Package Option 3: MachXO2
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LCMXO2-4000ZE-1FTG256I Details

  • Manufacturer Part Number:

    LCMXO2-4000ZE-1FTG256I

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Malaysia, Philippines, Taiwan

  • ECCN Code:

    3A991.D

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Lattice Semiconductor Corporation

  • YTEOL:

    19

  • Clock Frequency-Max:

    86.2 MHz

  • JESD-30 Code:

    S-PBGA-B256

  • JESD-609 Code:

    e1

  • Length:

    17 mm

  • Moisture Sensitivity Level:

    3

  • Number of Inputs:

    206

  • Number of Logic Cells:

    4320

  • Number of Outputs:

    206

  • Number of Terminals:

    256

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    540 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LBGA

  • Package Equivalence Code:

    BGA256,16X16,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE

  • Packing Method:

    TRAY

  • Peak Reflow Temperature (Cel):

    260

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.55 mm

  • Supply Voltage-Max:

    1.26 V

  • Supply Voltage-Min:

    1.14 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    17 mm

LCMXO2-4000ZE-1FTG256I Frequently Asked Questions (FAQs)

  • The LCMXO2-4000ZE-1FTG256I has an industrial temperature range of -40°C to 100°C, making it suitable for a wide range of applications.
  • The LCMXO2-4000ZE-1FTG256I can be programmed using Lattice's iCEcube2 design software and the Lattice Diamond Programmer software. The device can also be programmed in-system using the IEEE 1532 standard.
  • The power consumption of the LCMXO2-4000ZE-1FTG256I depends on the operating frequency and the design implementation. However, the typical static power consumption is around 50-100 μW, and the dynamic power consumption is around 100-200 μW/MHz.
  • No, the LCMXO2-4000ZE-1FTG256I is not a radiation-hardened device. It is not designed to withstand high levels of radiation and should not be used in space or other radiation-intensive applications.
  • The LCMXO2-4000ZE-1FTG256I supports clock frequencies up to 480 MHz, making it suitable for high-speed applications.

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LCMXO2-4000ZE-1FTG256I Overview

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