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LCMXO2-4000ZE-2BG256C - Lattice Semiconductor

Description: CPLD MachXO2 Family 1.2V 256-Pin CABGA Tray

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LCMXO2-4000ZE-2BG256C - Lattice Semiconductor PCB footprint - BGA - BGA - 256-Ball caBGA
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3D Models
LCMXO2-4000ZE-2BG256C - Lattice Semiconductor  - 3D model - BGA - 256-Ball caBGA
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LCMXO2-4000ZE-2BG256C Details

  • Manufacturer Part Number:

    LCMXO2-4000ZE-2BG256C

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Malaysia, Philippines, Taiwan

  • ECCN Code:

    3A991.D

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Lattice Semiconductor Corporation

  • YTEOL:

    19

  • Clock Frequency-Max:

    86.2 MHz

  • JESD-30 Code:

    S-PBGA-B256

  • JESD-609 Code:

    e1

  • Length:

    14 mm

  • Moisture Sensitivity Level:

    3

  • Number of Inputs:

    206

  • Number of Logic Cells:

    4320

  • Number of Outputs:

    206

  • Number of Terminals:

    256

  • Operating Temperature-Max:

    85 °C

  • Organization:

    540 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFBGA

  • Package Equivalence Code:

    BGA256,16X16,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE, FINE PITCH

  • Packing Method:

    TRAY

  • Peak Reflow Temperature (Cel):

    260

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.7 mm

  • Supply Voltage-Max:

    1.26 V

  • Supply Voltage-Min:

    1.14 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    14 mm

LCMXO2-4000ZE-2BG256C Frequently Asked Questions (FAQs)

  • Lattice provides a PCB design guide and layout recommendations in their documentation, including guidelines for signal integrity, power distribution, and thermal management. It's essential to follow these guidelines to ensure optimal performance and reliability.
  • To optimize power consumption, use the Lattice Power Calculator tool to estimate power consumption based on your design requirements. Additionally, implement power-saving techniques such as clock gating, voltage scaling, and dynamic voltage and frequency scaling (DVFS) in your design.
  • The internal oscillator has a limited frequency range and accuracy. If your design requires a higher frequency or tighter frequency tolerance, use an external clock source. Additionally, if you need to synchronize multiple devices or ensure a specific clock phase relationship, an external clock source is recommended.
  • Use the Lattice Diamond software to generate a reliable configuration bitstream. Ensure that the configuration interface (e.g., SPI or JTAG) is properly connected and configured. Also, follow the recommended programming and configuration procedures to prevent errors and ensure data integrity.
  • The LCMXO2-4000ZE-2BG256C has a maximum junction temperature of 125°C. Ensure proper thermal management by providing adequate heat dissipation through a heat sink, thermal pad, or other cooling mechanisms. Follow Lattice's thermal management guidelines to prevent overheating and ensure reliable operation.

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LCMXO2-4000ZE-2BG256C Overview

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