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LFE2-6E-7FN256C - Lattice Semiconductor

Description: FPGA - Field Programmable Gate Array 6K LUTs 190 I/O DSP 1.2V -7

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LFE2-6E-7FN256C - Lattice Semiconductor PCB footprint - BGA - BGA - 256-FPBGA 17x17
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LFE2-6E-7FN256C - Lattice Semiconductor  - 3D model - BGA - 256-FPBGA 17x17
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LFE2-6E-7FN256C Details

  • Manufacturer Part Number:

    LFE2-6E-7FN256C

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    BGA

  • Package Description:

    FPBGA-256

  • Pin Count:

    256

  • Country Of Origin:

    Malaysia, Philippines, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Lattice Semiconductor Corporation

  • YTEOL:

    9

  • Clock Frequency-Max:

    420 MHz

  • Combinatorial Delay of a CLB-Max:

    0.304 ns

  • JESD-30 Code:

    S-PBGA-B256

  • JESD-609 Code:

    e1

  • Length:

    17 mm

  • Moisture Sensitivity Level:

    3

  • Number of CLBs:

    750

  • Number of Inputs:

    190

  • Number of Logic Cells:

    6000

  • Number of Outputs:

    190

  • Number of Terminals:

    256

  • Operating Temperature-Max:

    85 °C

  • Organization:

    750 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA256,16X16,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    250

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.1 mm

  • Supply Voltage-Max:

    1.26 V

  • Supply Voltage-Min:

    1.14 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    17 mm

LFE2-6E-7FN256C Frequently Asked Questions (FAQs)

  • The LFE2-6E-7FN256C FPGA has an industrial temperature range of -40°C to 100°C, and a commercial temperature range of 0°C to 85°C.
  • Lattice recommends using a CDC IP core or a FIFO-based CDC implementation to ensure reliable data transfer between clock domains. The Lattice Diamond software provides tools and resources to help implement CDCs.
  • The power consumption of the LFE2-6E-7FN256C FPGA depends on the design, clock frequency, and operating conditions. Lattice provides a Power Calculator tool to estimate power consumption based on the design's characteristics.
  • The LFE2-6E-7FN256C FPGA is not specifically designed for radiation-hardened or high-reliability applications. However, Lattice offers other FPGA families, such as the RHINO and ECP5, that are designed for such applications.
  • Lattice provides a range of security features, including TransFR, a bitstream encryption and authentication mechanism, and a Secure Configuration mechanism to protect the FPGA's configuration data.

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LFE2-6E-7FN256C Overview

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Part Image LFE2-6SE-5FN256C Lattice Semiconductor Corporation

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Part Image LFE2-6SE-6FN256I Lattice Semiconductor Corporation

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Part Image LFE2-6SE-7F256C Lattice Semiconductor Corporation

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Part Image LFE2-6E-6F256C Lattice Semiconductor Corporation

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Part Image LFE2-6SE-7F256I Lattice Semiconductor Corporation

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For a full list of alternate parts for LFE2-6E-7FN256C, check out Findchips.com