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LFE2M20SE-5FN484C - Lattice Semiconductor

Description: IC FPGA 304 I/O 484FBGA

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PCB Footprints
LFE2M20SE-5FN484C - Lattice Semiconductor PCB footprint - BGA - BGA - 484-Ball fpBGA
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3D Models
LFE2M20SE-5FN484C - Lattice Semiconductor  - 3D model - BGA - 484-Ball fpBGA
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LFE2M20SE-5FN484C Details

  • Manufacturer Part Number:

    LFE2M20SE-5FN484C

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    BGA

  • Package Description:

    FPBGA-484

  • Pin Count:

    484

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    3A991.D

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Lattice Semiconductor Corporation

  • YTEOL:

    9

  • Clock Frequency-Max:

    311 MHz

  • Combinatorial Delay of a CLB-Max:

    0.358 ns

  • JESD-30 Code:

    S-PBGA-B484

  • JESD-609 Code:

    e1

  • Length:

    23 mm

  • Moisture Sensitivity Level:

    3

  • Number of CLBs:

    2375

  • Number of Inputs:

    304

  • Number of Logic Cells:

    20000

  • Number of Outputs:

    304

  • Number of Terminals:

    484

  • Operating Temperature-Max:

    85 °C

  • Organization:

    6000 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA484,22X22,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    250

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.6 mm

  • Supply Voltage-Max:

    1.26 V

  • Supply Voltage-Min:

    1.14 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    23 mm

LFE2M20SE-5FN484C Frequently Asked Questions (FAQs)

  • Lattice provides a PCB Design and Layout Guide document that provides guidelines for PCB layout and routing, including recommendations for signal integrity, power distribution, and thermal management. Additionally, the company offers a PCB Wizard tool that helps generate a PCB layout and routing template for the specific FPGA device.
  • Lattice recommends a power-up sequence that involves ramping up the power supply voltage in a controlled manner, followed by a delay to allow the internal voltage regulators to stabilize. The company provides a Power-Up Sequence Application Note that provides more detailed guidance on implementing a reliable and efficient power-up sequence.
  • Lattice recommends using a heat sink or thermal interface material to dissipate heat from the FPGA. The company provides thermal models and simulation tools to help estimate the thermal performance of the device. Additionally, Lattice recommends following good PCB design practices, such as using thermal vias and thermal layers, to help dissipate heat.
  • Lattice provides a Timing Closure and Synchronization Guide document that provides guidance on meeting timing and synchronization requirements. The company also offers a variety of tools, including the Lattice Diamond software, that can help with timing analysis and optimization.
  • The LFE2M20SE-5FN484C FPGA has a range of security features, including bitstream encryption, secure boot, and secure key storage. Lattice provides a Security User Guide that provides more detailed information on these features and how to implement them in a design. Additionally, the company offers a range of security-related IP cores and tools to help designers implement secure systems.

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LFE2M20SE-5FN484C Overview

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