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LFE2M35E-5FN672C - Lattice Semiconductor

Description: Lattice FPGA LFE2M35E-5FN672C, ECP2M 34000 Cells, 72704bit, 34000 Blocks, 672-Pin FBGA

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LFE2M35E-5FN672C - Lattice Semiconductor PCB footprint - BGA - BGA - 672-Ball fpBGA
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LFE2M35E-5FN672C - Lattice Semiconductor  - 3D model - BGA - 672-Ball fpBGA
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LFE2M35E-5FN672C Details

  • Manufacturer Part Number:

    LFE2M35E-5FN672C

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    BGA

  • Package Description:

    FPBGA-672

  • Pin Count:

    672

  • Country Of Origin:

    Malaysia, Taiwan

  • ECCN Code:

    3A991.D

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Lattice Semiconductor Corporation

  • YTEOL:

    9

  • Clock Frequency-Max:

    311 MHz

  • Combinatorial Delay of a CLB-Max:

    0.358 ns

  • JESD-30 Code:

    S-PBGA-B672

  • JESD-609 Code:

    e1

  • Length:

    27 mm

  • Moisture Sensitivity Level:

    3

  • Number of CLBs:

    4250

  • Number of Inputs:

    410

  • Number of Logic Cells:

    35000

  • Number of Outputs:

    410

  • Number of Terminals:

    672

  • Operating Temperature-Max:

    85 °C

  • Organization:

    4250 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA672,26X26,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    250

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.6 mm

  • Supply Voltage-Max:

    1.26 V

  • Supply Voltage-Min:

    1.14 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    27 mm

LFE2M35E-5FN672C Frequently Asked Questions (FAQs)

  • Lattice Semiconductor provides a PCB layout guide and reference design files for the LFE2M35E-5FN672C. It is recommended to follow these guidelines to ensure optimal performance and signal integrity.
  • A recommended power-up sequence involves powering up the core voltage (VCC) first, followed by the auxiliary voltage (VCCAUX), and then the input/output voltage (VCCIO). A soft-start circuit can be used to control the power-up sequence and prevent voltage overshoot.
  • The LFE2M35E-5FN672C has a maximum junction temperature of 100°C. To ensure reliable operation, it is recommended to keep the device temperature below 85°C. A heat sink or thermal pad can be used to dissipate heat, and thermal interface material can be applied to improve heat transfer.
  • To minimize EMI, it is recommended to use a multi-layer PCB with a solid ground plane, and to route high-speed signals on inner layers. Additionally, using differential signaling, terminating signals properly, and using EMI filters can help reduce EMI.
  • A reliable clocking scheme involves using a high-quality clock source, such as a crystal oscillator or a phase-locked loop (PLL). It is also recommended to use a clock distribution network with a low skew and jitter, and to implement clock domain crossing (CDC) logic to ensure data integrity.

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LFE2M35E-5FN672C Overview

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Part Image LFE2M35E-5F672I Lattice Semiconductor Corporation

Field Programmable Gate Array, 4250 CLBS, 311MHz, 35000-Cell, PBGA672

Part Image LFE2M35E-5F672C Lattice Semiconductor Corporation

Field Programmable Gate Array, 4250 CLBS, 311MHz, 35000-Cell, PBGA672