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LM20136MH/NOPB - Texas Instruments

Description: Texas Instruments LM20136MH/NOPB, Step Down DC-DC Converter, 6A, Adjustable, 0.8 → 5 V, 16-Pin TSSOP

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PCB Footprints
LM20136MH/NOPB - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - PWP0016A PowerPAD HTSSOP - 1.2 mm max height
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3D Models
LM20136MH/NOPB - Texas Instruments  - 3D model - Small Outline Packages - PWP0016A PowerPAD HTSSOP - 1.2 mm max height
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LM20136MH/NOPB Details

  • Manufacturer Part Number:

    LM20136MH/NOPB

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Additional Feature:

    SEATED HGT-NOM, OUTPUT VOLTAGE IS ADJUSTABLE DOWN TO 0.8V

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    5.5 V

  • Input Voltage-Min:

    2.95 V

  • Input Voltage-Nom:

    5 V

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    6 A

  • Output Voltage-Max:

    5 V

  • Output Voltage-Min:

    0.8 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSSOP

  • Package Equivalence Code:

    TSSOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Switching Frequency-Max:

    1500 kHz

  • Technology:

    BICMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

LM20136MH/NOPB Frequently Asked Questions (FAQs)

  • A good PCB layout for the LM20136MH/NOPB should prioritize thermal dissipation. Place the device near a thermal pad or a heat sink, and ensure good copper pour coverage around the device. Avoid routing high-current traces under the device, and keep the thermal pad connected to a solid ground plane.
  • To ensure stability, follow the recommended component values and PCB layout guidelines in the datasheet. Additionally, ensure that the output capacitor has a low equivalent series resistance (ESR) and is placed close to the output pin. You can also add a small ceramic capacitor (e.g., 10nF) in parallel with the output capacitor to improve stability.
  • The maximum input voltage for the LM20136MH/NOPB is 42V. Exceeding this voltage can cause damage to the device. Ensure that the input voltage is within the recommended operating range to ensure reliable operation.
  • The output voltage ripple and noise can be calculated using the equations provided in the datasheet. The output voltage ripple is primarily dependent on the output capacitor value, ESR, and the switching frequency. You can use simulation tools or online calculators to estimate the output voltage ripple and noise.
  • The recommended input capacitor value is 10uF to 22uF, with a voltage rating of at least 50V. A low-ESR ceramic or film capacitor is recommended, such as an X5R or X7R dielectric capacitor. Avoid using electrolytic capacitors as they can cause reliability issues.

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LM20136MH/NOPB Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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