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LM20154MHX/NOPB - Texas Instruments

Description: Switching Voltage Regulators 4A, 1MHz Synchronous Buck Regulator with SYNCOUT 16-HTSSOP -40 to 125

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LM20154MHX/NOPB - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - PWP0016A TSSOP
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3D Models
LM20154MHX/NOPB - Texas Instruments  - 3D model - Small Outline Packages - PWP0016A TSSOP
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LM20154MHX/NOPB Details

  • Manufacturer Part Number:

    LM20154MHX/NOPB

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Additional Feature:

    SEATED HGT-NOM, ALSO OPERATES IN ADJUSTABLE MODE DOWN TO 0.8V

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    5.5 V

  • Input Voltage-Min:

    2.95 V

  • Input Voltage-Nom:

    5 V

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    4 A

  • Output Voltage-Max:

    5 V

  • Output Voltage-Min:

    0.8 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSSOP

  • Package Equivalence Code:

    TSSOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Switching Frequency-Max:

    1000 kHz

  • Technology:

    BICMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

LM20154MHX/NOPB Frequently Asked Questions (FAQs)

  • Texas Instruments recommends a 2-layer or 4-layer PCB with a solid ground plane on the bottom layer and a thermal relief pattern on the top layer to ensure good thermal conductivity. Additionally, keeping the thermal pad connected to the ground plane can help to reduce thermal resistance.
  • To ensure reliable operation in high-temperature environments, it's essential to follow proper thermal design and layout guidelines, such as keeping the device away from heat sources, using a heat sink if necessary, and ensuring good airflow. Additionally, derating the device's power dissipation according to the temperature derating curve in the datasheet can help to prevent overheating.
  • Operating the device beyond the recommended operating conditions can lead to reduced reliability, decreased performance, and potentially even device failure. It's essential to ensure that the device operates within the recommended voltage, current, and temperature ranges to maintain its performance and longevity.
  • To troubleshoot issues with the device's output voltage regulation, start by verifying the input voltage, output voltage, and load current. Check for any signs of overheating, and ensure that the device is properly soldered and connected to the PCB. If the issue persists, consult the datasheet and application notes for guidance on troubleshooting and potential solutions.
  • The LM20154MHX/NOPB is designed to minimize electromagnetic interference (EMI) and radio-frequency interference (RFI). However, proper PCB layout, grounding, and shielding can help to further reduce EMI and RFI. Additionally, using a ferrite bead or common-mode choke on the input and output lines can help to filter out high-frequency noise.

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LM20154MHX/NOPB Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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