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LM3269TLE/NOPB - Texas Instruments

Description: Seamless Transition Buck/Boost Converter for LTE and HSPA RF Power Amplifiers

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PCB Footprints
LM3269TLE/NOPB - Texas Instruments PCB footprint - BGA - BGA - YZR0012_a
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3D Models
LM3269TLE/NOPB - Texas Instruments  - 3D model - BGA - YZR0012_a
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LM3269TLE/NOPB Details

  • Manufacturer Part Number:

    LM3269TLE/NOPB

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Additional Feature:

    ALSO OPERATES IN PFM CONTROL TECHNIQUE; ADJUSTABLE OUTPUT MODE FROM 0.6 TO 4.2V

  • Analog IC - Other Type:

    BATTERY CHARGE CONTROLLER

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    5.5 V

  • Input Voltage-Min:

    2.7 V

  • Input Voltage-Nom:

    3.6 V

  • JESD-30 Code:

    R-PBGA-B12

  • JESD-609 Code:

    e1

  • Length:

    2.499 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    12

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -30 °C

  • Output Current-Max:

    0.75 A

  • Output Voltage-Max:

    4.2 V

  • Output Voltage-Min:

    0.6 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.675 mm

  • Supply Current-Max (Isup):

    1900 mA

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK-BOOST

  • Switching Frequency-Max:

    2700 kHz

  • Technology:

    CMOS

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.9915 mm

LM3269TLE/NOPB Frequently Asked Questions (FAQs)

  • Texas Instruments recommends a 2-layer or 4-layer PCB with a solid ground plane on the bottom layer and a thermal relief pattern on the top layer to minimize thermal resistance. A thermal pad on the bottom of the package should be connected to the ground plane.
  • To ensure reliable startup and shutdown, it is recommended to use a soft-start circuit to limit the inrush current and to add a capacitor on the input voltage line to filter out noise and voltage spikes.
  • The maximum allowed voltage on the EN pin is 6V. Exceeding this voltage may damage the device. It is recommended to use a voltage divider or a clamp circuit to limit the voltage on the EN pin.
  • The LM3269TLE/NOPB is rated for operation up to 125°C. However, the device's performance and reliability may degrade at high temperatures. It is recommended to derate the output current and to use a heat sink to maintain a safe junction temperature.
  • To troubleshoot oscillations or instability issues, check the PCB layout for noise coupling, ensure that the input and output capacitors are properly selected and placed, and verify that the feedback loop is properly compensated. Also, check for any signs of overheating or overvoltage stress.

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LM3269TLE/NOPB Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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