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LM3444MM/NOPB - Texas Instruments

Description: Texas Instruments LM3444MM/NOPB, LED Display Driver, 8 → 13 V, 10-Pin VSSOP

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LM3444MM/NOPB - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGS0010A
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LM3444MM/NOPB - Texas Instruments  - 3D model - Small Outline Packages - DGS0010A
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LM3444MM/NOPB Details

  • Manufacturer Part Number:

    LM3444MM/NOPB

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    MSOP

  • Package Description:

    VSSOP-10

  • Pin Count:

    10

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Data Input Mode:

    SERIAL

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    LED DISPLAY DRIVER

  • JESD-30 Code:

    S-PDSO-G10

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Multiplexed Display Capability:

    NO

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Segments:

    1

  • Number of Terminals:

    10

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    CONSTANT-CURRENT

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP10,.19,20

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.09 mm

  • Supply Current-Max:

    2.25 mA

  • Supply Voltage-Max:

    13 V

  • Supply Voltage-Min:

    8 V

  • Supply Voltage-Nom:

    12 V

  • Supply Voltage1-Max:

    13 V

  • Supply Voltage1-Min:

    8 V

  • Supply Voltage1-Nom:

    12 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

LM3444MM/NOPB Frequently Asked Questions (FAQs)

  • Texas Instruments recommends a 2-layer or 4-layer PCB with a solid ground plane on the bottom layer and a thermal relief pattern on the top layer to minimize thermal resistance. Additionally, placing the device near a thermal pad or heat sink can improve thermal performance.
  • To ensure reliable start-up and operation with a wide input voltage range, it is recommended to add a soft-start circuit to limit the inrush current and prevent voltage drops. Additionally, using a high-quality input capacitor with low ESR and a sufficient voltage rating can help to filter out noise and voltage transients.
  • When selecting the output capacitor, consider the following factors: capacitance value, voltage rating, ESR, and temperature rating. A higher capacitance value can improve output ripple and noise, but may increase the cost and size of the capacitor. A low ESR capacitor can help to reduce output voltage ripple and improve transient response.
  • To minimize EMI in your design, use a shielded inductor, keep the switching node (SW) as short as possible, and use a common-mode choke or EMI filter on the input and output lines. Additionally, placing the device away from sensitive circuits and using a metal enclosure can help to reduce EMI radiation.
  • For high-power applications, it is essential to consider thermal design carefully. Ensure good airflow around the device, use a heat sink with a high thermal conductivity, and apply a thermal interface material (TIM) to minimize thermal resistance. Additionally, consider using a device with a higher power rating or a more efficient thermal design.

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LM3444MM/NOPB Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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