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LM3702XCTP-308 - Texas Instruments

Description: Supervisory Circuits

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PCB Footprints
LM3702XCTP-308 - Texas Instruments PCB footprint - BGA - BGA - DSBGA (9)
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3D Models
LM3702XCTP-308 - Texas Instruments  - 3D model - BGA - DSBGA (9)
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LM3702XCTP-308 Details

  • Manufacturer Part Number:

    LM3702XCTP-308

  • Rohs Code:

    No

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    FBGA, BGA9,3X3,20

  • Reach Compliance Code:

    Compliant

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Adjustable Threshold:

    NO

  • JESD-30 Code:

    S-PBGA-B9

  • JESD-609 Code:

    e0

  • Moisture Sensitivity Level:

    1

  • Number of Terminals:

    9

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    FBGA

  • Package Equivalence Code:

    BGA9,3X3,20

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Supply Current-Max (Isup):

    0.05 mA

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    TIN LEAD

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Threshold Voltage-Nom:

    +3.08V

  • Time@Peak Reflow Temperature-Max (s):

    40

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LM3702XCTP-308 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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