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LM3880MFE-1AB/NOPB - Texas Instruments

Description: 3 Rail Simple Power Sequencer with Fixed Time Delay

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PCB Footprints
LM3880MFE-1AB/NOPB - Texas Instruments PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - DBV0006A
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3D Models
LM3880MFE-1AB/NOPB - Texas Instruments  - 3D model - SOT23 (6-Pin) - DBV0006A
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LM3880MFE-1AB/NOPB Details

  • Manufacturer Part Number:

    LM3880MFE-1AB/NOPB

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-23

  • Package Description:

    SOT-23, 6 PIN

  • Pin Count:

    6

  • Country Of Origin:

    Mainland China, Malaysia, Philippines, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    POWER SEQUENCER

  • JESD-30 Code:

    R-PDSO-G6

  • Length:

    2.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Equivalence Code:

    TSOP6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.45 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.6 mm

LM3880MFE-1AB/NOPB Frequently Asked Questions (FAQs)

  • A good PCB layout for the LM3880 involves keeping the input and output traces short and away from each other, using a star-ground configuration, and placing the decoupling capacitors close to the IC. A 4-layer PCB with a dedicated ground plane is recommended.
  • The gain resistors (R1 and R2) should be chosen based on the desired gain and input impedance. A higher gain requires smaller resistors, while a higher input impedance requires larger resistors. The datasheet provides a gain calculation formula to help with the selection.
  • The maximum power dissipation of the LM3880 is dependent on the ambient temperature and the thermal resistance of the package. The datasheet provides a power dissipation calculation formula and a thermal resistance value to help determine the maximum power dissipation.
  • Yes, the LM3880 can be used as a headphone amplifier. However, it's essential to ensure that the output power and impedance are suitable for the headphones. The LM3880 can deliver up to 68mW per channel into a 32Ω load, making it suitable for low-to-moderate power headphone applications.
  • The LM3880 has built-in overvoltage protection, but it's still recommended to add external protection devices such as TVS diodes or zener diodes to protect against overvoltage and ESD. Additionally, following proper PCB design and layout practices can help prevent ESD damage.

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LM3880MFE-1AB/NOPB Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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