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LM3880QMFE-1AD/NOPB - Texas Instruments

Description: Automotive grade 3 rail simple power sequencer with fixed time delay

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PCB Footprints
LM3880QMFE-1AD/NOPB - Texas Instruments PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - DBV0006A
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3D Models
LM3880QMFE-1AD/NOPB - Texas Instruments  - 3D model - SOT23 (6-Pin) - DBV0006A
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LM3880QMFE-1AD/NOPB Details

  • Manufacturer Part Number:

    LM3880QMFE-1AD/NOPB

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-23

  • Package Description:

    SOT-23, 6 PIN

  • Pin Count:

    6

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    POWER SEQUENCER

  • JESD-30 Code:

    R-PDSO-G6

  • Length:

    2.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Equivalence Code:

    TSOP6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.45 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.6 mm

LM3880QMFE-1AD/NOPB Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the datasheet, but it's also important to follow general high-frequency PCB design guidelines, such as keeping the power supply traces short and wide, using a solid ground plane, and minimizing signal trace lengths and loops.
  • The choice of input and output capacitors depends on the specific application and frequency range. In general, use low-ESR capacitors with a high ripple current rating for the output capacitors, and film or ceramic capacitors for the input capacitors. The datasheet provides some guidance on capacitor selection, but it's also important to consider the specific requirements of your design.
  • The maximum power dissipation of the LM3880QMFE-1AD/NOPB is dependent on the ambient temperature and the thermal resistance of the package. According to the datasheet, the maximum power dissipation is 20W at 25°C, but this can be derated to 15W at 50°C. It's important to ensure that the device is properly heat-sinked and that the thermal design is adequate for the specific application.
  • The LM3880QMFE-1AD/NOPB has built-in overvoltage protection, but it's still important to ensure that the device is protected from excessive voltage transients. Consider adding external overvoltage protection devices, such as TVS diodes or zener diodes, to protect the device from voltage spikes. Additionally, ensure that the power supply voltage is within the recommended range to prevent undervoltage conditions.
  • The recommended heatsink for the LM3880QMFE-1AD/NOPB depends on the specific application and the power dissipation requirements. In general, a heatsink with a thermal resistance of less than 10°C/W is recommended. Consider using a heatsink with a large surface area and a thermal interface material to ensure good thermal contact.

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LM3880QMFE-1AD/NOPB Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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