LM3S6911-IBZ50-A2 - Texas Instruments

LM3S6911-IBZ50-A2 Details

• Manufacturer Part Number:

  LM3S6911-IBZ50-A2

• Brand Name:

  Texas Instruments

• Pbfree Code:

  Yes

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Obsolete

• Part Package Code:

  BGA

• Package Description:

  BGA-108

• Pin Count:

  108

• ECCN Code:

  3A991.A.2

• HTS Code:

  8542.31.00.01

• Manufacturer:

  Texas Instruments

• YTEOL:

  0

• Has ADC:

  NO

• Bit Size:

  32

• Boundary Scan:

  YES

• CPU Family:

  CORTEX-M3

• Clock Frequency-Max:

  0.032 MHz

• DAC Channels:

  NO

• DMA Channels:

  NO

• Format:

  FIXED POINT

• Integrated Cache:

  YES

• JESD-30 Code:

  S-PBGA-B108

• JESD-609 Code:

  e1

• Length:

  10 mm

• Low Power Mode:

  YES

• Moisture Sensitivity Level:

  3

• Number of I/O Lines:

  46

• Number of Serial I/Os:

  8

• Number of Terminals:

  108

• Number of Timers:

  4

• On Chip Data RAM Width:

  8

• On Chip Program ROM Width:

  8

• Operating Temperature-Max:

  85 °C

• Operating Temperature-Min:

  -40 °C

• PWM Channels:

  YES

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  LFBGA

• Package Equivalence Code:

  BGA108,12X12,32

• Package Shape:

  SQUARE

• Package Style:

  GRID ARRAY

• Peak Reflow Temperature (Cel):

  260

• Qualification Status:

  Not Qualified

• RAM (bytes):

  65536

• ROM (words):

  262144

• ROM Programmability:

  FLASH

• Seated Height-Max:

  1.5 mm

• Speed:

  50 MHz

• Supply Voltage-Max:

  2.75 V

• Supply Voltage-Min:

  2.5 V

• Supply Voltage-Nom:

  2.5 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Temperature Grade:

  INDUSTRIAL

• Terminal Finish:

  Tin/Silver/Copper (Sn/Ag/Cu)

• Terminal Form:

  BALL

• Terminal Pitch:

  0.8 mm

• Terminal Position:

  BOTTOM

• Time@Peak Reflow Temperature-Max (s):

  30

• Width:

  10 mm

• uPs/uCs/Peripheral ICs Type:

  MICROCONTROLLER, RISC