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LM4040D30IDBZRG4 - Texas Instruments

Description: Voltage References 3-V Precision Micpwr Shunt 1% acc

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LM4040D30IDBZRG4 - Texas Instruments - PCB symbol
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PCB Footprints
LM4040D30IDBZRG4 - Texas Instruments PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - DBZ0003A height 1.12
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LM4040D30IDBZRG4 - Texas Instruments - 3D model - SOT23 (3-Pin) - DBZ0003A height 1.12
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LM4040D30IDBZRG4 Details

  • Manufacturer Part Number:

    LM4040D30IDBZRG4

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOT-23

  • Package Description:

    GREEN, PLASTIC, SOT-23, 3 PIN

  • Pin Count:

    3

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Analog IC - Other Type:

    TWO TERMINAL VOLTAGE REFERENCE

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e4

  • Length:

    2.92 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Voltage-Max:

    3.03 V

  • Output Voltage-Min:

    2.97 V

  • Output Voltage-Nom:

    3 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TO-236

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.12 mm

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temp Coef of Voltage-Max:

    150 ppm/°C

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    NICKEL PALLADIUM GOLD

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Trim/Adjustable Output:

    NO

  • Voltage Tolerance-Max:

    1%

  • Width:

    1.3 mm

LM4040D30IDBZRG4 Frequently Asked Questions (FAQs)

  • Texas Instruments recommends a star-grounded layout with a single-point ground connection to minimize noise and ensure stability. Additionally, keep the input and output capacitors close to the device and use short, wide traces to reduce inductance.
  • The LM4040D30IDBZRG4 has a thermal shutdown feature that activates when the junction temperature exceeds 150°C. To prevent overheating, ensure good airflow, use a heat sink if necessary, and keep the device away from other heat sources. Also, follow the recommended PCB layout and thermal design guidelines.
  • Texas Instruments recommends a 1-10μF ceramic or film capacitor with an X7R or X5R dielectric for the input capacitor. The capacitor value should be chosen based on the input voltage and desired ripple rejection.
  • Yes, the LM4040D30IDBZRG4 is qualified for automotive and high-reliability applications. It meets the AEC-Q100 standard for automotive applications and is manufactured using a high-reliability process. However, additional testing and validation may be required for specific applications.
  • Follow the recommended soldering and assembly guidelines provided by Texas Instruments. Use a soldering iron with a temperature of 260°C or less, and ensure the device is properly aligned and seated on the PCB. Avoid applying excessive force or pressure during assembly.

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LM4040D30IDBZRG4 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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