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LM4041DEX3-1.2+T - Analog Devices

Description: Ultra-Small 3-Pin SC70 Package 0.1% (max) Initial Accuracy 100ppm/°C (max) Temperature CoefficientGuaranteed over -40°C to +125°C TemperatureRange Wide Operating Current Range: 60µA to 12mA Low 20µVRMS Output Noise (10Hz to 10kHz) 1.225V Fixed Reverse Breakdown Voltage No Output Capacitors Required Tolerates Capacitive Loads

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LM4041DEX3-1.2+T - Analog Devices PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - X3+2
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LM4041DEX3-1.2+T - Analog Devices  - 3D model - SOT23 (3-Pin) - X3+2
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LM4041DEX3-1.2+T Details

  • Manufacturer Part Number:

    LM4041DEX3-1.2+T

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    3-SC70-N/A

  • Package Description:

    TSSOP, TSSOP3/6,.08

  • Pin Count:

    3

  • Manufacturer Package Code:

    3-SC70-N/A

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Date Of Intro:

    2000-04-07

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Analog IC - Other Type:

    TWO TERMINAL VOLTAGE REFERENCE

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Length:

    2 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Voltage-Max:

    1.2373 V

  • Output Voltage-Min:

    1.2128 V

  • Output Voltage-Nom:

    1.225 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP3/6,.08

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temp Coef of Voltage-Max:

    150 ppm/°C

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Trim/Adjustable Output:

    NO

  • Voltage Tolerance-Max:

    1%

  • Width:

    1.25 mm

LM4041DEX3-1.2+T Frequently Asked Questions (FAQs)

  • A good PCB layout for the LM4041DEX3-1.2+T involves keeping the input and output pins as close as possible to minimize noise and parasitic inductance. Additionally, a solid ground plane and decoupling capacitors can help to reduce noise and improve stability.
  • To ensure stability, make sure to follow the recommended PCB layout and decoupling capacitor values. Also, ensure that the output capacitor is within the recommended range (10uF to 100uF) and that the input voltage is within the specified range (2.5V to 12V).
  • The LM4041DEX3-1.2+T can sink or source up to 10mA of current, making it suitable for low-power applications.
  • Yes, the LM4041DEX3-1.2+T is suitable for use as a voltage reference for ADCs or DACs due to its low noise and high accuracy (±1.5mV) output voltage.
  • The LM4041DEX3-1.2+T has a built-in power-on reset circuit that ensures a stable output voltage during power-up and power-down. The device also has a low quiescent current during shutdown, making it suitable for battery-powered applications.

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LM4041DEX3-1.2+T Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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