ALSO OPTS IN PFM CONTROL TECH, ALSO AVLB VOUT = 5V, ALSO OPTS IN ADJ MODE FROM 3.3 TO 6V
Analog IC - Other Type:
SWITCHING REGULATOR
Control Mode:
CURRENT-MODE
Control Technique:
PULSE WIDTH MODULATION
Input Voltage-Max:
42 V
Input Voltage-Min:
3.5 V
Input Voltage-Nom:
13.5 V
JESD-30 Code:
R-PDSO-G16
JESD-609 Code:
e4
Length:
5 mm
Moisture Sensitivity Level:
3
Number of Functions:
1
Number of Outputs:
1
Number of Terminals:
16
Operating Temperature-Max:
150 °C
Operating Temperature-Min:
-40 °C
Output Current-Max:
2 A
Output Voltage-Max:
9.9 V
Output Voltage-Min:
3.2 V
Output Voltage-Nom:
3.3 V
Package Body Material:
PLASTIC/EPOXY
Package Code:
HSOP
Package Equivalence Code:
TSSOP16,.25
Package Shape:
RECTANGULAR
Package Style:
SMALL OUTLINE, HEAT SINK/SLUG
Peak Reflow Temperature (Cel):
260
Qualification Status:
Not Qualified
Screening Level:
AEC-Q100
Seated Height-Max:
1 mm
Surface Mount:
YES
Switcher Configuration:
BUCK
Switching Frequency-Max:
2350 kHz
Temperature Grade:
AUTOMOTIVE
Terminal Finish:
Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form:
GULL WING
Terminal Pitch:
0.65 mm
Terminal Position:
DUAL
Time@Peak Reflow Temperature-Max (s):
30
Width:
4.4 mm
LM536023QPWPRQ1 Frequently Asked Questions (FAQs)
A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, and ensuring good thermal conductivity between the device and the heat sink. The datasheet provides some guidelines, but a more detailed application note from TI provides additional guidance.
To ensure proper power-up and configuration, follow the recommended power-up sequence outlined in the datasheet, and make sure to configure the device's registers according to the application requirements. TI also provides a software development kit (SDK) that includes example code and documentation to help with configuration.
Operating the device at high temperatures can affect its performance, reliability, and lifespan. The datasheet provides thermal specifications, but it's essential to consider the application's thermal environment and take measures to mitigate thermal stress, such as using heat sinks or thermal interfaces.
TI provides a range of debugging tools and resources, including oscilloscopes, logic analyzers, and software development kits (SDKs). Engineers can also consult the datasheet, application notes, and online forums for troubleshooting guidance. In some cases, contacting TI's technical support may be necessary.
To ensure EMC and minimize EMI, follow proper PCB layout and design guidelines, use shielding and filtering as needed, and consider the device's electromagnetic characteristics. TI provides some guidance in the datasheet, but additional resources, such as application notes and online forums, can provide more detailed information.
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LM536023QPWPRQ1 Overview
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About Texas Instruments
Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.
