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LM6144BIMX/NOPB - Texas Instruments

Description: Quad High Speed/Low Power 17 MHz Rail-to-Rail I/O Operational Amplifier

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LM6144BIMX/NOPB - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - D (R-PDSO-G14)
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LM6144BIMX/NOPB - Texas Instruments  - 3D model - Small Outline Packages - D (R-PDSO-G14)
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LM6144BIMX/NOPB Details

  • Manufacturer Part Number:

    LM6144BIMX/NOPB

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    14

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Date Of Intro:

    1993-01-01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.526 µA

  • Bias Current-Max (IIB) @25C:

    0.28 µA

  • Common-mode Reject Ratio-Min:

    84 dB

  • Common-mode Reject Ratio-Nom:

    107 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.03 µA

  • Input Offset Voltage-Max:

    1000 µV

  • JESD-30 Code:

    R-PDSO-G14

  • JESD-609 Code:

    e3

  • Length:

    8.65 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    4

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP14,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Slew Rate-Min:

    11 V/us

  • Slew Rate-Nom:

    25 V/us

  • Subcategory:

    Operational Amplifier

  • Supply Current-Max:

    3.2 mA

  • Supply Voltage Limit-Max:

    35 V

  • Supply Voltage-Nom (Vsup):

    2.7 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    17000

  • Voltage Gain-Min:

    25000

  • Wideband:

    NO

  • Width:

    3.9 mm

LM6144BIMX/NOPB Frequently Asked Questions (FAQs)

  • A good PCB layout for the LM6144BIMX/NOPB should include a solid ground plane, wide power traces, and a thermal relief pattern around the device. TI recommends a 2-layer or 4-layer PCB with a thermal via array under the device to improve heat dissipation.
  • To ensure stability, use a minimum output capacitance of 10uF, and ensure the output capacitor's ESR is within the recommended range (0.1Ω to 10Ω). Additionally, use a low-ESR input capacitor (e.g., ceramic or film capacitor) and keep the input capacitor close to the device.
  • The LM6144BIMX/NOPB can handle input voltages up to 42V, but it's recommended to operate within the specified input voltage range (4.5V to 36V) for optimal performance and reliability.
  • Use an external current sense resistor (RSENSE) to monitor the output current and implement overcurrent protection (OCP) using an external circuit or a dedicated OCP IC. Also, ensure proper thermal design and heat sinking to prevent overheating.
  • The LM6144BIMX/NOPB is rated for operation up to 125°C, but its performance and reliability may degrade at high temperatures. Ensure proper thermal design, heat sinking, and derating to ensure reliable operation in high-temperature environments.

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LM6144BIMX/NOPB Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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