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LM74701QDDFRQ1 - Texas Instruments

Description: TVS Less Automotive Reverse Battery Protection Ideal Diode Controller

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PCB Footprints
LM74701QDDFRQ1 - Texas Instruments PCB footprint - SOT23 (8-Pin) - SOT23 (8-Pin) - DDF0008A_2022
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3D Models
LM74701QDDFRQ1 - Texas Instruments  - 3D model - SOT23 (8-Pin) - DDF0008A_2022
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LM74701QDDFRQ1 Details

  • Manufacturer Part Number:

    LM74701QDDFRQ1

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Additional Feature:

    Overvoltage Switch Mode

  • Adjustable Threshold:

    YES

  • Analog IC - Other Type:

    INPUT FAULT PROTECTION CONTROLLER

  • Input Voltage-Max:

    65 V

  • Input Voltage-Min:

    3.2 V

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    2.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.11

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.1 mm

  • Supply Voltage-Max (Vsup):

    60 V

  • Supply Voltage-Min (Vsup):

    4 V

  • Supply Voltage-Nom (Vsup):

    12 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Threshold Voltage-Nom:

    +2.8V

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.6 mm

LM74701QDDFRQ1 Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, using a 2-layer or 4-layer board, and minimizing the distance between the device and the thermal pad or heat sink. Additionally, using thermal vias and a solid ground plane can help to dissipate heat more efficiently.
  • To ensure reliable operation over the full temperature range, it is essential to follow proper PCB design and layout guidelines, use a suitable thermal management system, and ensure that the device is operated within its recommended operating conditions. Additionally, using a thermistor or a temperature sensor can help to monitor the device temperature and prevent overheating.
  • To mitigate EMI and RFI, it is essential to use proper shielding, grounding, and filtering techniques. This includes using a metal shield around the device, connecting the shield to the ground plane, and using EMI filters or ferrite beads on the input and output lines. Additionally, using a common-mode choke and a differential-mode filter can help to reduce EMI and RFI emissions.
  • To optimize the device for low power consumption, it is essential to operate the device at the lowest possible voltage, use a low-power mode or shutdown mode when not in use, and minimize the output current. Additionally, using a power-saving mode, reducing the switching frequency, and using a low-power oscillator can help to reduce power consumption.
  • To ensure device reliability and longevity, it is essential to operate the device within its recommended operating conditions, avoid overheating, and minimize electrical stress. Additionally, using a suitable PCB material, following proper soldering and assembly techniques, and using a conformal coating can help to improve device reliability and longevity.

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LM74701QDDFRQ1 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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