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LM96080CIMT/NOPB - Texas Instruments

Description: Texas Instruments LM96080CIMT/NOPB, Processor Supervisor -0.3 → 6 V, WDT, 24-Pin TSSOP

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LM96080CIMT/NOPB - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - PW (R-PDSO-G24)
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LM96080CIMT/NOPB - Texas Instruments  - 3D model - Small Outline Packages - PW (R-PDSO-G24)
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LM96080CIMT/NOPB Details

  • Manufacturer Part Number:

    LM96080CIMT/NOPB

  • Brand Name:

    Texas Instruments

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TSSOP

  • Pin Count:

    24

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    VOLTAGE SUPERVISOR/RESET IC

  • JESD-30 Code:

    R-PDSO-G24

  • JESD-609 Code:

    e3

  • Length:

    7.8 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    24

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SSOP

  • Package Equivalence Code:

    TSOP24,.25,25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Supply Current-Max (Isup):

    0.58 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

LM96080CIMT/NOPB Frequently Asked Questions (FAQs)

  • A good PCB layout for the LM96080CIMT/NOPB should include a solid ground plane, wide power traces, and a thermal relief pattern under the device to facilitate heat dissipation. A 4-layer PCB with a dedicated thermal layer is recommended.
  • To ensure the device operates within the recommended operating conditions, monitor the input voltage, output voltage, and output current. Implement overvoltage protection, undervoltage protection, and overcurrent protection to prevent damage to the device.
  • To minimize EMI and noise, use a pi-filter (L-C-L) or a common-mode choke at the input, and a ferrite bead or a small inductor at the output. Additionally, use a shielded inductor and a low-ESR output capacitor to reduce radiated emissions.
  • To optimize the device for low standby power consumption, ensure the enable pin is properly controlled, and the device is fully disabled during shutdown. Also, use a low-quiescent-current regulator for the bias supply, and consider using a low-power mode or a power gating technique.
  • To manage thermal performance, ensure good airflow around the device, and use a heat sink or a thermal interface material (TIM) to reduce the thermal resistance. Monitor the junction temperature and adjust the device's operating conditions to prevent overheating.

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LM96080CIMT/NOPB Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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