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LMC6035IMMX/NOPB - Texas Instruments

Description: Dual low power 2.7V single supply CMOS operational amplifier

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LMC6035IMMX/NOPB - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGK  (S-PDSO-G8)
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LMC6035IMMX/NOPB Details

  • Manufacturer Part Number:

    LMC6035IMMX/NOPB

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    MSOP

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.00009 µA

  • Bias Current-Max (IIB) @25C:

    2e-7 µA

  • Common-mode Reject Ratio-Min:

    60 dB

  • Common-mode Reject Ratio-Nom:

    96 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.000045 µA

  • Input Offset Voltage-Max:

    5000 µV

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR, 13 INCH

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Slew Rate-Nom:

    1.5 V/us

  • Supply Current-Max:

    1.9 mA

  • Supply Voltage Limit-Max:

    16 V

  • Supply Voltage-Nom (Vsup):

    2.7 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    1400

  • Voltage Gain-Min:

    20000

  • Wideband:

    NO

  • Width:

    3 mm

LMC6035IMMX/NOPB Frequently Asked Questions (FAQs)

  • A good PCB layout for the LMC6035IMMX/NOPB involves separating the analog and digital grounds, using a solid ground plane, and keeping the input and output traces short and away from each other. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • To ensure the LMC6035IMMX/NOPB is operating within its recommended operating conditions, make sure the supply voltage is within the range of 2.7V to 5.5V, the operating temperature is within the range of -40°C to 125°C, and the input voltage is within the range of VCC-1.5V to VCC+0.5V.
  • The recommended capacitor value for the bypass capacitor connected to the VCC pin is 0.1uF to 1uF, with a voltage rating of at least 6.3V. A ceramic capacitor with a low ESR (Equivalent Series Resistance) is recommended.
  • To reduce noise and oscillations in the output of the LMC6035IMMX/NOPB, use a low-pass filter at the output, ensure the input is properly filtered and decoupled, and use a stable and low-noise power supply. Additionally, minimize the length of the output traces and use a shielded cable if the output is connected to a remote load.
  • The recommended method for thermal management of the LMC6035IMMX/NOPB is to use a heat sink or a thermal pad on the exposed pad of the package, and to ensure good airflow around the device. The thermal pad should be connected to a solid ground plane to ensure good heat dissipation.

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LMC6035IMMX/NOPB Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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