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LMC6061AIM - Texas Instruments

Description: OpAmpIC

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LMC6061AIM - Texas Instruments - PCB symbol
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PCB Footprints
LMC6061AIM - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - D0008A
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3D Models
LMC6061AIM - Texas Instruments - 3D model - Small Outline Packages - D0008A
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LMC6061AIM Details

  • Manufacturer Part Number:

    LMC6061AIM

  • Pbfree Code:

    No

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC

  • Package Description:

    SOIC-8

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.000004 µA

  • Common-mode Reject Ratio-Min:

    72 dB

  • Common-mode Reject Ratio-Nom:

    85 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    900 µV

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e0

  • Length:

    4.9 mm

  • Low-Bias:

    YES

  • Low-Offset:

    YES

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    235

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Slew Rate-Min:

    0.01 V/us

  • Slew Rate-Nom:

    0.035 V/us

  • Supply Current-Max:

    0.038 mA

  • Supply Voltage Limit-Max:

    16 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    TIN LEAD

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    20

  • Unity Gain BW-Nom:

    100

  • Voltage Gain-Min:

    50000

  • Wideband:

    NO

  • Width:

    3.9 mm

LMC6061AIM Frequently Asked Questions (FAQs)

  • Texas Instruments recommends a compact layout with the LMC6061AIM placed close to the analog-to-digital converter (ADC) or digital-to-analog converter (DAC) it is driving. Keep the input and output traces short and away from digital signals. Use a solid ground plane and decouple the power supply with a 10uF capacitor.
  • The LMC6061AIM has a built-in current limit of 30mA per channel. To handle this, ensure that the output impedance of the load is not too low, and consider adding a series resistor to limit the current. You can also use an external current sense resistor to monitor the output current.
  • Power up the LMC6061AIM in the following sequence: VCC, then VREF, and finally the digital inputs. This ensures that the internal biasing and reference circuits are properly established before the device is enabled.
  • To optimize high-frequency performance, use a low-ESR capacitor (e.g., ceramic or film capacitor) for decoupling, and keep the input and output traces short and well-matched. Use a differential output configuration and consider adding a ferrite bead or series resistor to reduce high-frequency noise.
  • The LMC6061AIM has a thermal derating of 13.9mW/°C above 25°C. This means that the device's power dissipation must be reduced as the temperature increases to prevent overheating. Ensure good thermal design and heat sinking to maintain optimal performance.

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LMC6061AIM Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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