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LMC6062IM/NOPB - Texas Instruments

Description: Precision CMOS Dual Micropower Operational Amplifier

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LMC6062IM/NOPB - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - D
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LMC6062IM/NOPB Details

  • Manufacturer Part Number:

    LMC6062IM/NOPB

  • Brand Name:

    Texas Instruments

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.000004 µA

  • Bias Current-Max (IIB) @25C:

    1e-7 µA

  • Common-mode Reject Ratio-Min:

    75 dB

  • Common-mode Reject Ratio-Nom:

    85 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.000002 µA

  • Input Offset Voltage-Max:

    350 µV

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TUBE

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Slew Rate-Min:

    0.007 V/us

  • Slew Rate-Nom:

    0.035 V/us

  • Supply Current-Max:

    0.038 mA

  • Supply Voltage Limit-Max:

    16 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    100

  • Voltage Gain-Min:

    35000

  • Wideband:

    NO

  • Width:

    3.9 mm

LMC6062IM/NOPB Frequently Asked Questions (FAQs)

  • A good PCB layout for the LMC6062IM/NOPB involves keeping the input and output traces separate, using a solid ground plane, and placing the device close to the power supply. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane to minimize noise and ensure optimal performance.
  • To ensure the LMC6062IM/NOPB is operating within its recommended operating conditions, make sure to operate it within the recommended voltage range of 2.7V to 5.5V, and keep the junction temperature below 150°C. Also, ensure that the device is not exposed to excessive moisture or humidity.
  • The recommended capacitor value for the bypass capacitor (CBYP) in the LMC6062IM/NOPB is 0.1uF to 1uF, with a voltage rating of at least 6.3V. A ceramic capacitor with a low ESR (Equivalent Series Resistance) is recommended.
  • To troubleshoot issues with the LMC6062IM/NOPB, start by checking the power supply voltage and ensuring it is within the recommended range. Check for any noise or ripple on the power supply lines, and ensure that the device is properly decoupled. Also, check the PCB layout and ensure that it is following the recommended layout guidelines. If the issue persists, try reducing the gain of the amplifier or adding a compensation capacitor to stabilize the amplifier.
  • The recommended thermal management strategy for the LMC6062IM/NOPB involves using a heat sink or a thermal pad to dissipate heat away from the device. Ensure that the device is mounted on a PCB with a solid ground plane, and use thermal vias to dissipate heat to the ground plane. Additionally, consider using a thermal interface material (TIM) to improve heat transfer between the device and the heat sink.

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LMC6062IM/NOPB Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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