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LMC6482IN - Texas Instruments

Description: OP Amps

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LMC6482IN - Texas Instruments PCB footprint - Dual-In-Line Packages - Dual-In-Line Packages - P (R-PDIP-T8)
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LMC6482IN - Texas Instruments  - 3D model - Dual-In-Line Packages - P (R-PDIP-T8)
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LMC6482IN Details

  • Manufacturer Part Number:

    LMC6482IN

  • Pbfree Code:

    No

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    DIP

  • Package Description:

    PLASTIC, DIP-8

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.000004 µA

  • Common-mode Reject Ratio-Min:

    60 dB

  • Common-mode Reject Ratio-Nom:

    82 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    3000 µV

  • JESD-30 Code:

    R-PDIP-T8

  • JESD-609 Code:

    e0

  • Length:

    9.817 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP8,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Packing Method:

    RAIL

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    5.08 mm

  • Slew Rate-Min:

    0.63 V/us

  • Slew Rate-Nom:

    1.3 V/us

  • Supply Current-Max:

    1.9 mA

  • Supply Voltage Limit-Max:

    16 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    NO

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    TIN LEAD

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Unity Gain BW-Nom:

    1500

  • Voltage Gain-Min:

    10000

  • Wideband:

    NO

  • Width:

    7.62 mm

LMC6482IN Frequently Asked Questions (FAQs)

  • The maximum power dissipation of the LMC6482IN is dependent on the package type and ambient temperature. For the SOIC package, the maximum power dissipation is 670mW at 25°C. For the PDIP package, it is 830mW at 25°C. However, it's recommended to derate the power dissipation based on the ambient temperature to ensure reliable operation.
  • To ensure stability in a unity-gain buffer configuration, it's recommended to add a capacitor (typically 10-100pF) between the output and the inverting input pins. This capacitor helps to compensate for the internal pole of the op-amp and prevents oscillations.
  • To minimize noise and EMI, it's recommended to follow good PCB layout practices such as keeping the input and output traces separate, using a solid ground plane, and avoiding long traces that can act as antennas. Additionally, it's recommended to place a 0.1uF decoupling capacitor between the power supply pins and the ground plane, and to use a low-ESR capacitor to filter the power supply noise.
  • While the LMC6482IN can be used as a comparator, it's not recommended due to its limited slew rate and bandwidth. The LMC6482IN is designed as a general-purpose op-amp, and its performance may not be suitable for high-speed comparator applications. Texas Instruments recommends using a dedicated comparator device, such as the LM339 or LM2901, for comparator applications.
  • The input bias current of the LMC6482IN is typically around 10fA, which is very low. However, it's still important to consider the input bias current when designing the circuit. To minimize the effects of input bias current, it's recommended to use a high-impedance input source, such as a voltage divider or a buffer stage, and to ensure that the input impedance is matched to the source impedance.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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