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LMC6494BEM - Texas Instruments

Description: OpAmpIC

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LMC6494BEM - Texas Instruments PCB footprint - Other - Other - SOIC127P600X175-14N
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LMC6494BEM - Texas Instruments  - 3D model - Other - SOIC127P600X175-14N
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LMC6494BEM Details

  • Manufacturer Part Number:

    LMC6494BEM

  • Brand Name:

    Texas Instruments

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC

  • Package Description:

    SOIC-14

  • Pin Count:

    14

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.0002 µA

  • Common-mode Reject Ratio-Nom:

    82 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    6800 µV

  • JESD-30 Code:

    R-PDSO-G14

  • JESD-609 Code:

    e0

  • Length:

    8.65 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Neg Supply Voltage Limit-Max:

    -8 V

  • Number of Functions:

    4

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP14,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    RAIL

  • Peak Reflow Temperature (Cel):

    235

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Slew Rate-Min:

    0.5 V/us

  • Slew Rate-Nom:

    1.3 V/us

  • Supply Current-Max:

    4.6 mA

  • Supply Voltage Limit-Max:

    16 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    TIN LEAD

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    20

  • Unity Gain BW-Nom:

    1500

  • Voltage Gain-Min:

    40000

  • Wideband:

    NO

  • Width:

    3.9 mm

LMC6494BEM Frequently Asked Questions (FAQs)

  • Texas Instruments recommends a 4-layer PCB with a solid ground plane, and to keep the analog and digital grounds separate. Additionally, use short and direct traces for the input and output signals, and avoid routing signals under the device. Refer to the TI application note 'AN-1112 Four-Layer PCB Layout and Routing for the LMC6494' for more details.
  • The gain and offset of the LMC6494BEM can be configured using external resistors and capacitors. Refer to the datasheet's 'Application Information' section and the 'Gain and Offset Configuration' subsection for equations and examples. You can also use TI's WEBENCH Filter Designer tool to help with the design and calculation of the gain and offset settings.
  • The maximum input voltage for the LMC6494BEM is ±5.5V, which is the absolute maximum rating. However, the recommended input voltage range is ±3.5V to ensure optimal performance and linearity. Exceeding the maximum input voltage can damage the device.
  • The LMC6494BEM is specified to operate from -40°C to 125°C. Ensure that the device is properly heatsinked, and the PCB is designed to dissipate heat efficiently. Also, consider using thermal management techniques such as thermal vias, thermal pads, and heat sinks to keep the device within its specified temperature range.
  • The recommended power-up sequence for the LMC6494BEM is to apply the analog power supply (VCC) before the digital power supply (VDD). This ensures that the analog circuitry is powered up before the digital circuitry, preventing any potential damage or incorrect operation.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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