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LMC662AIN - Texas Instruments

Description: OP AMP

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LMC662AIN - Texas Instruments PCB footprint - Dual-In-Line Packages - Dual-In-Line Packages - P-(R-PDIP-T8)
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LMC662AIN - Texas Instruments  - 3D model - Dual-In-Line Packages - P-(R-PDIP-T8)
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LMC662AIN Details

  • Manufacturer Part Number:

    LMC662AIN

  • Pbfree Code:

    No

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    DIP

  • Package Description:

    PLASTIC, DIP-8

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.000004 µA

  • Bias Current-Max (IIB) @25C:

    0.000004 µA

  • Common-mode Reject Ratio-Min:

    70 dB

  • Common-mode Reject Ratio-Nom:

    83 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    3300 µV

  • JESD-30 Code:

    R-PDIP-T8

  • JESD-609 Code:

    e0

  • Length:

    9.817 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP8,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Packing Method:

    RAIL

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    5.08 mm

  • Slew Rate-Min:

    0.6 V/us

  • Slew Rate-Nom:

    1.1 V/us

  • Supply Current-Max:

    1.5 mA

  • Supply Voltage Limit-Max:

    16 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    NO

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    TIN LEAD

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Unity Gain BW-Nom:

    1400

  • Voltage Gain-Min:

    60000

  • Wideband:

    NO

  • Width:

    7.62 mm

LMC662AIN Frequently Asked Questions (FAQs)

  • The maximum power dissipation of the LMC662AIN is dependent on the package type and thermal resistance. For the SOIC package, the maximum power dissipation is approximately 670mW at 25°C ambient temperature. However, it's essential to calculate the power dissipation based on the specific application and thermal environment.
  • To ensure stability in a unity-gain configuration, it's crucial to follow proper layout and decoupling techniques. Use a low-ESR capacitor (e.g., 10nF to 100nF) between the power supply pins and the GND pin, and keep the input and output traces short and symmetrical. Additionally, consider adding a small capacitor (e.g., 10pF to 100pF) in parallel with the feedback resistor to improve stability.
  • The recommended input common-mode voltage range for the LMC662AIN is between VCC-1.5V and VCC+0.5V. Operating outside this range may affect the op-amp's performance, stability, and accuracy.
  • While the LMC662AIN can be used as a comparator, it's not the most suitable choice. The op-amp's output stage is designed for linear operation, and its slew rate and bandwidth may not be optimized for high-speed comparator applications. If you need a comparator, consider using a dedicated comparator IC like the LM339 or LM2901.
  • The LMC662AIN has internal ESD protection diodes, but it's still essential to follow proper ESD handling and protection techniques during PCB assembly and handling. Use ESD-safe materials, wrist straps, and mats, and consider adding external ESD protection devices (e.g., TVS diodes) if your application requires it.

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LMC662AIN Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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Part Image LMC662AIN National Semiconductor Corporation

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