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LMC6772BIN/NOPB - Texas Instruments

Description: Texas Instruments LMC6772BIN/NOPB Dual Comparator, Open Drain O/P, 0.3μs 2.7 → 15 V 8-Pin PDIP

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PCB Footprints
LMC6772BIN/NOPB - Texas Instruments PCB footprint - Dual-In-Line Packages - Dual-In-Line Packages - P (R-PDIP-T8)
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3D Models
LMC6772BIN/NOPB - Texas Instruments  - 3D model - Dual-In-Line Packages - P (R-PDIP-T8)
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LMC6772BIN/NOPB Details

  • Manufacturer Part Number:

    LMC6772BIN/NOPB

  • Brand Name:

    Texas Instruments

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    DIP

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Amplifier Type:

    COMPARATOR

  • Average Bias Current-Max (IIB):

    4e-7 µA

  • Bias Current-Max (IIB) @25C:

    4e-7 µA

  • Input Offset Voltage-Max:

    5000 µV

  • JESD-30 Code:

    R-PDIP-T8

  • JESD-609 Code:

    e3

  • Length:

    9.817 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Type:

    OPEN-COLLECTOR; OPEN-DRAIN

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP8,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Packing Method:

    TUBE

  • Qualification Status:

    Not Qualified

  • Response Time-Nom:

    4000 ns

  • Seated Height-Max:

    5.08 mm

  • Subcategory:

    Comparator

  • Supply Current-Max:

    0.01 mA

  • Supply Voltage Limit-Max:

    16 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    NO

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Width:

    7.62 mm

LMC6772BIN/NOPB Frequently Asked Questions (FAQs)

  • The recommended layout and placement for the LMC6772BIN/NOPB involves keeping the input and output pins as close as possible to the device, using a solid ground plane, and minimizing the length of the input and output traces. Additionally, it is recommended to place the device near the power supply and to use a decoupling capacitor between the power supply and the device.
  • To optimize the performance of the LMC6772BIN/NOPB, it is recommended to follow the recommended layout and placement guidelines, use a low-ESR capacitor for decoupling, and ensure that the input and output impedances are matched. Additionally, the device should be operated within its recommended operating conditions, and the input signal should be within the recommended input voltage range.
  • The LMC6772BIN/NOPB has a maximum junction temperature of 150°C. To ensure reliable operation, it is recommended to keep the device temperature below 125°C. This can be achieved by providing adequate heat sinking, using a thermal interface material, and ensuring good airflow around the device.
  • To troubleshoot issues with the LMC6772BIN/NOPB, it is recommended to check the input and output signals using an oscilloscope, verify that the device is operated within its recommended operating conditions, and check for any signs of overheating or physical damage. Additionally, it is recommended to consult the datasheet and application notes for troubleshooting guidelines.
  • The LMC6772BIN/NOPB has built-in ESD protection, but it is still recommended to follow proper ESD handling procedures when handling the device. This includes using an ESD wrist strap or mat, storing the device in an ESD-safe environment, and avoiding touching the device's pins.

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LMC6772BIN/NOPB Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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